Reliability analysis of copper interconnection in system-in-package structure
Shih-Ying Chiang, Chan-Yan Chou, Ming-Chih Yew, Kuo-Ning Chiang
Published in 2007 International Conference on Electronic Materials and Packaging (01.11.2007)
Published in 2007 International Conference on Electronic Materials and Packaging (01.11.2007)
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