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"Chai Songgang"
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"Chai Songgang"
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Resin composition and application thereof
by
YAN SHANYIN
,
LUO CHENG
,
CHAI SONGGANG
Year of Publication
22.10.2021
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Fluorine-containing resin-based resin composition and application thereof
by
MO ZIJIE
,
HAO LIANGPENG
,
LIANG WEI
,
CHAI SONGGANG
Year of Publication
23.06.2023
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Fluorine-containing resin-based composite material and application thereof
by
MO ZIJIE
,
HAO LIANGPENG
,
LIANG WEI
,
CHAI SONGGANG
Year of Publication
18.04.2023
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Fluorine-containing resin-based composition and application thereof
by
MO ZIJIE
,
HAO LIANGPENG
,
LIANG WEI
,
CHAI SONGGANG
Year of Publication
28.03.2023
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Preparation method of multi-layer binding material
by
LIANG WEI
,
WANG QING
,
GUO HAOYONG
,
CHAI SONGGANG
,
LIU QIANFA
Year of Publication
03.03.2023
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Resin composition and application thereof
by
CHEN GUANGBING
,
HAO LIANGPENG
,
CHAI SONGGANG
Year of Publication
16.03.2021
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Reinforcing material impregnating device
by
CHAI SONGGANG
Year of Publication
19.03.2014
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68
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Non-woven fabric with low dielectric loss as well as preparation method and application of non-woven fabric
by
HAO LIANGPENG
,
LIANG WEI
,
CHAI SONGGANG
,
LIU QIANFA
Year of Publication
18.10.2022
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Non-woven fabric prepreg, metal foil-clad plate and printed circuit board
by
HAO LIANGPENG
,
LIANG WEI
,
CHAI SONGGANG
,
LIU QIANFA
Year of Publication
20.09.2022
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Non-woven fabric with low dielectric loss as well as preparation method and application of non-woven fabric
by
HAO LIANGPENG
,
LIANG WEI
,
CHAI SONGGANG
,
LIU QIANFA
Year of Publication
20.09.2022
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71
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Fluorine-containing resin copper-clad plate and multilayer circuit board
by
XU YONGJING
,
LIANG WEI
,
CHAI SONGGANG
,
LIU QIANFA
Year of Publication
20.09.2022
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Multi-layer binding material and preparation method and application thereof
by
HAO LIANGPENG
,
LIANG WEI
,
CHAI SONGGANG
,
LIU QIANFA
Year of Publication
09.09.2022
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73
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Thermosetting resin composition and application thereof
by
CHAI SONGGANG
Year of Publication
18.12.2013
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74
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Resin composition, resin-coated copper foil, metal foil-clad plate and application
by
MO ZIJIE
,
ZHOU BIAO
,
HAO LIANGPENG
,
LIANG WEI
,
CHAI SONGGANG
Year of Publication
29.03.2024
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FLUORINE-CONTAINING RESIN COMPOSITION AND RESIN GLUE SOLUTION COMPRISING SAME, FLUORINE-CONTAINING DIELECTRIC SHEET, LAMINATED BOARD, COPPER CLAD BOARD, AND PRINTED CIRCUIT BOARD
by
LIU, Qianfa
,
HAO, Liangpeng
,
CHAI
,
Songgang
,
LIANG, Wei
Year of Publication
16.06.2022
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THERMOSETTING RESIN COMPOSITION AND USE THEREOF
by
HAO, Liangpeng
,
CHAI
,
Songgang
,
DU, Cuiming
Year of Publication
28.06.2017
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Cyanate ester system resin composition, prepreg containing cyanate ester system resin composition, laminated board and printed circuit board
by
XU YONGJING
,
HAO LIANGPENG
,
CHAI SONGGANG
Year of Publication
03.05.2022
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Microwave drying machine
by
CHAI SONGGANG
Year of Publication
01.05.2013
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Composition for copper-clad laminate with low dielectric constant and copper-clad laminate manufactured by using same
by
CHAI SONGGANG
Year of Publication
02.01.2013
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Composition for copper foil-clad laminated sheet and copper foil-clad laminated sheet prepared from composition
by
CHAI SONGGANG
Year of Publication
10.10.2012
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