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"Chai Songgang"
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"Chai Songgang"
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Fluorine-containing resin composition, fluororesin-based dielectric layer and application of fluororesin-based dielectric layer
by
MO ZIJIE
,
CHAI SONGGANG
Year of Publication
29.03.2024
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Thermosetting resin composition and uses thereof
by
Chai
,
Songgang
,
Du, Cuiming
,
Hao, Liangpeng
Year of Publication
19.02.2019
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THERMOSETTING RESIN COMPOSITION, PREPREG CONTAINING SAME, LAMINATED BOARD, AND PRINTED CIRCUIT BOARD
by
Chai
,
Songgang
,
Chen, Wenxin
,
Du, Cuiming
Year of Publication
06.12.2018
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THERMOSETTING RESIN COMPOSITION AND USE THEREOF
by
HAO, Liangpeng
,
CHAI
,
Songgang
,
DU, Cuiming
Year of Publication
04.03.2020
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45
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RESIN COMPOSITION AND APPLICATION THEREOF
by
YAN, Shanyin
,
CHAI
,
Songgang
,
LUO, Cheng
Year of Publication
16.02.2023
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46
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FLUORINE-CONTAINING RESIN-BASED COMPOSITE MATERIAL AND USE THEREOF
by
MO, Zijie
,
HAO, Liangpeng
,
CHAI
,
Songgang
,
LIANG, Wei
Year of Publication
27.06.2024
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47
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Fluorine-containing resin-based dielectric layer and preparation method and application thereof
by
MO ZIJIE
,
HAO LIANGPENG
,
LIANG WEI
,
CHAI SONGGANG
Year of Publication
25.06.2024
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48
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THERMOSET RESIN SANDWICHED PRE-PREG BODY, MANUFACTURING METHOD AND COPPER CLAD PLATE
by
CHAI
,
SONGGANG
Year of Publication
03.12.2015
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49
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Resin composition, resin-coated copper foil and application thereof
by
MO ZIJIE
,
HAO LIANGPENG
,
LIANG WEI
,
CHAI SONGGANG
Year of Publication
26.03.2024
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Resin composition and application thereof
by
LIU SHENXING
,
JIE XINGDI
,
LIU QIANFA
,
CHAI SONGGANG
Year of Publication
22.03.2024
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51
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Fluorine-containing resin-based copper-clad plate and application thereof
by
MO ZIJIE
,
HAO LIANGPENG
,
LIANG WEI
,
CHAI SONGGANG
Year of Publication
23.02.2024
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52
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NON-WOVEN FABRIC PREPREG, METAL-FOIL-CLAD PLATE AND PRINTED CIRCUIT BOARD
by
LIU, Qianfa
,
HAO, Liangpeng
,
CHAI
,
Songgang
,
LIANG, Wei
Year of Publication
11.01.2024
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53
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FLUORINE-CONTAINING RESIN COPPER-CLAD LAMINATE AND MULTI-LAYER CIRCUIT BOARD
by
LIU, Qianfa
,
CHAI
,
Songgang
,
LIANG, Wei
,
XU, Yongjing
Year of Publication
11.01.2024
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Silicon dioxide slurry composition, resin composition containing silicon dioxide slurry composition, prepreg and laminated board
by
HAO LIANGPENG
,
ZENG JIE
,
CHAI SONGGANG
Year of Publication
03.05.2022
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Silicon dioxide slurry composition, resin composition containing silicon dioxide slurry composition, prepreg and laminated board
by
HAO LIANGPENG
,
ZENG JIE
,
CHAI SONGGANG
Year of Publication
03.05.2022
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56
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Thermosetting resin composition, prepreg, laminate and printed circuit board
by
HAO LIANGPENG
,
CHAI SONGGANG
Year of Publication
04.01.2019
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Thermosetting resin composition, prepreg, laminate and printed circuit board
by
XING YANXIA
,
CHAI SONGGANG
Year of Publication
30.10.2018
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Thermosetting resin composition, prereg, laminated board and printed circuit board
by
XING YANXIA
,
CHAI SONGGANG
Year of Publication
25.09.2018
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Epoxy resin composition and copper clad laminate manufactured by using same
by
Chai Songgang
,
Du Cuiming
,
Yang Zhongqiang
Year of Publication
25.10.2016
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Non-woven fabric with low dielectric loss as well as preparation and application of non-woven fabric
by
HAO LIANGPENG
,
LIANG WEI
,
CHAI SONGGANG
,
LIU QIANFA
Year of Publication
27.06.2023
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