An approach for the prediction of interfacial delamination of an a-Si3N4 /Si bilayer system
Lin, Pamela, Meng Chai, Chee, Xue, Ming, Xu, Huan, Zhou, Kun
Published in Journal of physics. D, Applied physics (09.08.2016)
Published in Journal of physics. D, Applied physics (09.08.2016)
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Journal Article
Virtual prototyping methodology for assessment of the interaction between wire bond pad design and bond process parameters to enhance the robustness of copper wire bond interconnect
Chai Chee Meng, Fink, Markus, Weiss, Laurens
Published in 2016 IEEE CPMT Symposium Japan (ICSJ) (01.11.2016)
Published in 2016 IEEE CPMT Symposium Japan (ICSJ) (01.11.2016)
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Conference Proceeding
An approach for the prediction of interfacial delamination of an a-Si 3 N 4 /Si bilayer system
Lin, Pamela, Meng Chai, Chee, Xue, Ming, Xu, Huan, Zhou, Kun
Published in Journal of physics. D, Applied physics (14.09.2016)
Published in Journal of physics. D, Applied physics (14.09.2016)
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Journal Article
An approach for the prediction of interfacial delamination of an a-Si sub(3)N sub(4) /Si bilayer system
Lin, Pamela, Chai, Chee Meng, Xue, Ming, Xu, Huan, Zhou, Kun
Published in Journal of physics. D, Applied physics (01.09.2016)
Published in Journal of physics. D, Applied physics (01.09.2016)
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Journal Article
Effect of substrate warpage on flip chip BGA thermal stress simulation
Chai Chee Meng, Stoeckl, S, Pape, H, Foo Mun Yee, Tan Ai Min
Published in 2010 12th Electronics Packaging Technology Conference (01.12.2010)
Published in 2010 12th Electronics Packaging Technology Conference (01.12.2010)
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Conference Proceeding
Thermo-mechanical modeling of a 3D flip chip fully populated BGA package
Chai, Chee Meng, Stoeckl, Stephan, Pape, Heinz, Mun Yee, Foo, Tan Ai Min, Tan
Published in 2010 12th Electronics Packaging Technology Conference (01.12.2010)
Published in 2010 12th Electronics Packaging Technology Conference (01.12.2010)
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Conference Proceeding