Interface traps density-of-states as a vital component for hot-carrier degradation modeling
Tyaginov, S.E., Starkov, I.A., Triebl, O., Cervenka, J., Jungemann, C., Carniello, S., Park, J.M., Enichlmair, H., Karner, M., Kernstock, Ch, Seebacher, E., Minixhofer, R., Ceric, H., Grasser, T.
Published in Microelectronics and reliability (01.09.2010)
Published in Microelectronics and reliability (01.09.2010)
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Journal Article
Stress measurements in tungsten coated through silicon vias for 3D integration
Krauss, C., Labat, S., Escoubas, S., Thomas, O., Carniello, S., Teva, J., Schrank, F.
Published in Thin solid films (01.03.2013)
Published in Thin solid films (01.03.2013)
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Conference Proceeding
Design and optimization of a hot-carrier resistant high-voltage nMOS transistor
Annese, M., Carniello, S., Manzini, S.
Published in IEEE transactions on electron devices (01.07.2005)
Published in IEEE transactions on electron devices (01.07.2005)
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Journal Article
Analysis of hot carrier effects in a 0.35 μm high voltage n-channel LDMOS transistor
Enichlmair, H., Carniello, S., Park, J.M., Minixhofer, R.
Published in Microelectronics and reliability (01.09.2007)
Published in Microelectronics and reliability (01.09.2007)
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Conference Proceeding
Regression of monoclonal B‐cell expansion in patients affected by mixed cryoglobulinemia responsive to α‐interferon therapy
Mazzaro, Cesare, Franzin, Francesco, Tulissi, Patrizia, Pussini, Elisabetta, Crovatto, Marina, Carniello, Giorgio S., Efremov, Dimitar G., Burrone, Oscar, Santini, Gianfranco, Pozzato, Gabriele
Published in Cancer (15.06.1996)
Published in Cancer (15.06.1996)
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Journal Article
Interferon versus steroids in patients with hepatitis C virus-associated cryoglobulinaemic glomerulonephritis
Mazzaro, C, Panarello, G, Carniello, S, Faelli, A, Mazzi, G, Crovatto, M, Baracetti, S, Nascimben, F, Zorat, F, Pozzato, G, Faccini, L, Campanacci, L
Published in Digestive and liver disease (01.11.2000)
Published in Digestive and liver disease (01.11.2000)
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Journal Article
Impact of across-wafer variation on the electrical performance of TSVs
Filipovic, L., Selberherr, S., Singulani, A. P., Roger, F., Carniello, S.
Published in 2016 IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC) (01.05.2016)
Published in 2016 IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC) (01.05.2016)
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Journal Article
Impact of hydrogen anneal on low frequency noise of n- and p-MOSFET
Ioannidis, E.G., Pflanzl, W.C., Stueckler, E., Vescoli, V., Carniello, S., Seebacher, E.
Published in Solid-state electronics (01.12.2016)
Published in Solid-state electronics (01.12.2016)
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Journal Article
Topography and Deformation Measurement and FE Modeling applied to substrate-mounted large area wafer-level packages (including stacked dice and TSVs)
Hert, M, Carniello, S, Cassidy, C
Published in 2010 17th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (01.07.2010)
Published in 2010 17th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (01.07.2010)
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Conference Proceeding
Hot-carrier degradation modeling using full-band Monte-Carlo simulations
Tyaginov, S E, Starkov, I A, Triebl, O, Cervenka, J, Jungemann, C, Carniello, S, Park, J M, Enichlmair, H, Karner, M, Kernstock, C, Seebacher, E, Minixhofer, R, Ceric, H, Grasser, T
Published in 2010 17th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (01.07.2010)
Published in 2010 17th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (01.07.2010)
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Conference Proceeding
Analysis of worst-case hot-carrier conditions for high voltage transistors based on full-band monte-carlo simulations
Starkov, I A, Tyaginov, S E, Triebl, O, Cervenka, J, Jungemann, C, Carniello, S, Park, J M, Enichlmair, H, Karner, M, Kernstock, C, Seebacher, E, Minixhofer, R, Ceric, H, Grasser, T
Published in 2010 17th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (01.07.2010)
Published in 2010 17th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (01.07.2010)
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Conference Proceeding
Effects of Bosch scallops on metal layer stress of an open Through Silicon Via technology
Singulani, A. P., Ceric, H., Langer, E., Carniello, S.
Published in 2013 IEEE International Reliability Physics Symposium (IRPS) (01.04.2013)
Published in 2013 IEEE International Reliability Physics Symposium (IRPS) (01.04.2013)
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Conference Proceeding
Passivation integrity investigations for through wafer interconnects
Kraft, J., Hueber, A., Carniello, S., Schrank, F., Wachmann, E.
Published in 2008 IEEE International Reliability Physics Symposium (01.04.2008)
Published in 2008 IEEE International Reliability Physics Symposium (01.04.2008)
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Conference Proceeding
Hot carrier stress degradation modes in p-type high voltage LDMOS transistors
Enichlmair, H., Park, J.M., Carniello, S., Loeffler, B., Minixhofer, R., Levy, M.
Published in 2009 IEEE International Reliability Physics Symposium (01.04.2009)
Published in 2009 IEEE International Reliability Physics Symposium (01.04.2009)
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Conference Proceeding
Modelling and characterization of a microhotplate
Singulani, A. P., Toschkoff, G., Sagmeister, M., Carniello, S.
Published in 2018 24rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) (01.09.2018)
Published in 2018 24rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) (01.09.2018)
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Conference Proceeding
Analysis of Electromigration in Dual-Damascene Interconnect Structures
Lacerda de Orio, Roberto, Carniello, Sara, Ceric, Hajdin, Selberherr, Siegfried
Published in ECS transactions (22.08.2008)
Published in ECS transactions (22.08.2008)
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Journal Article
3D-Resurf: The integration of a p-channel LDMOS in a standard CMOS process
Vescoli, V., Park, J.M., Carniello, S., Minixhofer, R.
Published in 2008 20th International Symposium on Power Semiconductor Devices and IC's (01.05.2008)
Published in 2008 20th International Symposium on Power Semiconductor Devices and IC's (01.05.2008)
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Conference Proceeding
Analysis of electromigration in redundant vias
Lacerda de Orio, R., Ceric, H., Carniello, S., Selberherr, S.
Published in 2008 International Conference on Simulation of Semiconductor Processes and Devices (01.09.2008)
Published in 2008 International Conference on Simulation of Semiconductor Processes and Devices (01.09.2008)
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Conference Proceeding