Anatomical studies of Baccharis articulata, Baccharis crispa and Baccharis trimera, carquejas used in folk medicine
CORTADI, A, DI SAPIO, O, MCCARGO, J, SCANDIZZI, A, GATTUSO, S, GATTUSO, M
Published in Pharmaceutical biology (01.12.1999)
Published in Pharmaceutical biology (01.12.1999)
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Journal Article
Advanced failure analysis of circuit-under-pad (CUP) structures in Cu/FSG and Cu/low k technologies
Huixian Wu, Archer, V., Merchant, S.M., Cargo, J., Chesire, D., Antol, J., Mengel, R., Osenbach, J., Horvat, S., Peridier, C., White, M.
Published in 2005 IEEE International Reliability Physics Symposium, 2005. Proceedings. 43rd Annual (2005)
Published in 2005 IEEE International Reliability Physics Symposium, 2005. Proceedings. 43rd Annual (2005)
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Conference Proceeding
Characterization of various etching techniques for gate level failure analysis and substrate decoration for advanced Cu/low k technologies
Huixian Wu, Cargo, J., White, M.
Published in Proceedings of the 12th International Symposium on the Physical and Failure Analysis of Integrated Circuits, 2005. IPFA 2005 (2005)
Published in Proceedings of the 12th International Symposium on the Physical and Failure Analysis of Integrated Circuits, 2005. IPFA 2005 (2005)
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Conference Proceeding
Physical failure analysis deprocessing and cross-section techniques for Cu/low-k technology
Huixian Wu, Hooghan, K., Cargo, J.
Published in IEEE transactions on device and materials reliability (01.03.2004)
Published in IEEE transactions on device and materials reliability (01.03.2004)
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Magazine Article
Quantum Mechanical Modeling of Nanoscale MOSFETs Carrier Transportation
Huixian Wu, White, M.H., Cargo, J.
Published in 2005 International Semiconductor Device Research Symposium (2005)
Published in 2005 International Semiconductor Device Research Symposium (2005)
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Conference Proceeding
Characterization of reactive ion etching of polysilicon over gate oxide for failure mode analysis deprocessing
Huixian Wu, Cargo, J., Serpiello, J., Mcginn, J.
Published in Proceedings of the 9th International Symposium on the Physical and Failure Analysis of Integrated Circuits (Cat. No.02TH8614) (2002)
Published in Proceedings of the 9th International Symposium on the Physical and Failure Analysis of Integrated Circuits (Cat. No.02TH8614) (2002)
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Conference Proceeding