On the Mechanical Stresses of Cu Through-Silicon Via (TSV) Samples Fabricated by SK Hynix vs. SEMATECH – Enabling Robust and Reliable 3-D Interconnect/Integrated Circuit (IC) Technology
Tian, Tian, Morusupalli, R., Shin, H., Son, H.-Y., Byun, K.-Y., Joo, Y.-C., Caramto, R., Smith, L., Shen, Y-L., Kunz, M., Tamura, N., Budiman, A.S.
Published in Procedia engineering (2016)
Published in Procedia engineering (2016)
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Journal Article
300-mm Production-Worthy Magnetically Enhanced Non-Bosch Through-Si-Via Etch for 3-D Logic Integration
Teh, W H, Caramto, R, Chidambaram, Thenappan, Wei Wang, Arkalgud, Sitaram R, Saito, T, Maruyama, K, Maekawa, Kaoru
Published in IEEE transactions on semiconductor manufacturing (01.05.2010)
Published in IEEE transactions on semiconductor manufacturing (01.05.2010)
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Journal Article
On the technology and ecosystem of 3D / TSV manufacturing
Hummler, K., Smith, L., Caramto, R., Edgeworth, R., Olson, S., Pascual, D., Qureshi, J., Rudack, A., Quon, R., Arkalgud, S.
Published in 2011 IEEE/SEMI Advanced Semiconductor Manufacturing Conference (01.05.2011)
Published in 2011 IEEE/SEMI Advanced Semiconductor Manufacturing Conference (01.05.2011)
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Conference Proceeding
Thermal and spatial dependence of TSV-induced stress in Si
McDonough, C., Backes, B., Wang, W., Caramto, R., Geer, R. E.
Published in 2011 IEEE International Interconnect Technology Conference (01.05.2011)
Published in 2011 IEEE International Interconnect Technology Conference (01.05.2011)
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Conference Proceeding
Magnetically-enhanced capacitively-coupled plasma etching for 300 mm wafer-scale fabrication of Cu through-silicon-vias for 3D logic integration
Teh, W.H., Caramto, R., Arkalgud, S., Saito, T., Maruyama, K., Maekawa, K.
Published in 2009 IEEE International Interconnect Technology Conference (01.06.2009)
Published in 2009 IEEE International Interconnect Technology Conference (01.06.2009)
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Conference Proceeding
Comparison of mechanical stresses of Cu Through-Silicon Via (TSV) samples fabricated by Hynix vs. SEMATECH using synchrotron X-ray microdiffraction for 3-D integration and reliability
Budiman, A. S., Shin, H., Kim, B.-J, Hwang, S.-H, Son, H.-Y, Suh, M.-S, Chung, Q.-H, Byun, K.-Y, Joo, Y.-C, Caramto, R., Smith, L., Kunz, M., Tamura, N.
Published in 2012 IEEE International Interconnect Technology Conference (01.06.2012)
Published in 2012 IEEE International Interconnect Technology Conference (01.06.2012)
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Conference Proceeding
A route towards production-worthy 5 µm × 25 µm and 1 µm × 20 µm non-Bosch through-silicon-via (TSV) etch, TSV metrology, and TSV integration
Teh, W.H., Caramto, R., Qureshi, J., Arkalgud, S., O'Brien, M., Gilday, T., Maekawa, K., Saito, T., Maruyama, K., Chidambaram, T., Wang, W., Marx, D., Grant, D., Dudley, R.
Published in 2009 IEEE International Conference on 3D System Integration (01.09.2009)
Published in 2009 IEEE International Conference on 3D System Integration (01.09.2009)
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Conference Proceeding