SEMICONDUCTOR DEVICE AND METHOD OF FORMING DOUBLE-SIDEDFAN-OUT WAFER LEVEL PACKAGE
SHIM, Il Kwon, CHOI, Won Kyoung, CAPARAS, Jose A, GOH, Sze Ping, MARIMUTHU, Pandi C
Year of Publication 27.02.2019
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Year of Publication 27.02.2019
Patent
Semiconductor Device and Method of Forming Wire Studs as Vertical Interconnect in FO-WLP
Marimuthu Pandi C, Lin Yaojian, Tan Yang Kern Jonathan, Alvarez Sheila Marie L, Caparas Jose A
Year of Publication 17.11.2016
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Year of Publication 17.11.2016
Patent
Semiconductor device having wire studs as vertical interconnect in FO-WLP
Marimuthu Pandi C, Lin Yaojian, Tan Yang Kern Jonathan, Alvarez Sheila Marie L, Caparas Jose A
Year of Publication 13.09.2016
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Year of Publication 13.09.2016
Patent
SEMICONDUCTOR DEVICE AND METHOD OF FORMING DOUBLE-SIDEDFAN-OUT WAFER LEVEL PACKAGE
CAPARAS, JOSE A, GOH, SZE PING, MARIMUTHU, PANDI C, CHOI, WON KYOUNG, SHIM, IL KWON
Year of Publication 30.03.2016
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Year of Publication 30.03.2016
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Semiconductor Device and Method of Forming Double-Sided Fan-Out Wafer Level Package
SHIM IL KWON, CAPARAS JOSE A, CHOI WON KYOUNG, MARIMUTHU PANDI C, GOH SZE PING
Year of Publication 11.02.2016
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Year of Publication 11.02.2016
Patent