MOL Local Interconnect Innovation: Materials, Process & Systems Co-optimization for 3nm Node and Beyond
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Published in 2022 International Electron Devices Meeting (IEDM) (03.12.2022)
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Growth and Etch Forms of Germanium Microcrystals on a Silicon Oxide Substrate
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Published in ECS transactions (18.08.2016)
Published in ECS transactions (18.08.2016)
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CVD 막들 내 결함들을 분석하기 위한 시스템들 및 방법들
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Year of Publication 07.06.2023
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Fin Doping by Hot Implant for 14nm FinFET Technology and Beyond
Wood, Bingxi Sun, Khaja, Fareen Adeni, Colombeau, Benjamin P, Sun, Shiyu, Waite, Andrew, Jin, Miao, Chen, Hao, Chan, Osbert, Thanigaivelan, Thirumal, Pradhan, Nilay, Gossmann, Hans-Joachim L, Sharma, Shashank, Chavva, Venkataramana R, Cai, Man-Ping, Okazaki, Motoya, Munnangi, Samuel Swaroop, Ni, Chi-Nung, Suen, Wesley, Chang, Chorng-Ping, Mayur, Abhilash, Variam, Naushad, Brand, Adam D
Published in ECS transactions (31.08.2013)
Published in ECS transactions (31.08.2013)
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Journal Article
유동성 CVD 막 결함 감소
PANDIT MANDAR B, LI WENHUI, CAI MAN PING, JHA PRAKET P, LIANG JINGMEI, TSIANG MICHAEL WENYOUNG
Year of Publication 19.01.2024
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Year of Publication 19.01.2024
Patent
Improvement of Si doping of In0.53Ga0.47As fin by heated implant
Wood, Bingxi, Hatem, Christopher, Xinyu Bao, Hongwen Zhou, Ming Zhang, Miao Jin, Hao Chen, Man-Ping Cai, Munnangi, Samuel Swaroop, Okazaki, Motoya, Sanchez, Errol, Brand, Adam
Published in 2015 International Symposium on VLSI Technology, Systems and Applications (01.04.2015)
Published in 2015 International Symposium on VLSI Technology, Systems and Applications (01.04.2015)
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Conference Proceeding
From simulation to characterization - integrated approach for Self Aligned Double Patterning defectivity
Conley, Amiad, Meshulach, Doron, Gichon, Guy, Dolev, Ido, Perlovitch, Renana, Landwer, Niv, Ngai, Chris, Man-Ping Cai, Liyan Miao
Published in 2008 International Symposium on Semiconductor Manufacturing (ISSM) (01.10.2008)
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Published in 2008 International Symposium on Semiconductor Manufacturing (ISSM) (01.10.2008)
Conference Proceeding
AMORPHOUS CARBON DEPOSITION METHOD FOR IMPROVED STACK DEFECTIVITY
YU HANG, YOSHIDA NAOMI, CHENG SIU F, PARK, HEUNG LAK, PARK, SO HYUN, MIAO LI YAN, KIM BOK HOEN, PADHI DEENESH, CAI MAN PING, SHAIKH SHAHID
Year of Publication 21.10.2013
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Year of Publication 21.10.2013
Patent
SYSTEMS AND METHODS FOR ANALYZING DEFECTS IN CVD FILMS
Li, Wenhui, Cai, Man-Ping, Jha, Praket Prakash, Tsiang, Michael Wenyoung, Pandit, Mandar B, Leng, Jingmin
Year of Publication 02.11.2023
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Year of Publication 02.11.2023
Patent
Systems and methods for analyzing defects in CVD films
Li, Wenhui, Cai, Man-Ping, Jha, Praket Prakash, Tsiang, Michael Wenyoung, Pandit, Mandar B, Leng, Jingmin
Year of Publication 11.07.2023
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Year of Publication 11.07.2023
Patent
Tungsten Interconnect Resistance Reduction Enabling Energy Efficient and High Performance Applications for 2nm Node and Beyond
Thareja, Gaurav, Pal, Ashish, Ma, Quan, Ching, Chi, Patel, Sahil, Gao, Xingyao, Dag, Sefa, Qi, Zhimin, Zhang, Aixi, Yue, Shiyu, Lei, Wei, Xu, Yi, Lei, Yu, Jiang, Hao, You, Shi, Zheng, Wenkai, Hung, Raymond, Costrini, Gregory, Zhu, Qing, Tran, Randy, Gupta, Rohit, Reddy, Vinod, Vyas, Pratik B., Hassan, Sajjad, Cai, Man Ping, Shen, Gang, Chen, Zhebo, Hou, Wenting, Lei, Jianxin, Wang, Rongjun, Shen, Walters, Deshpande, Sameer, Huey, Sidney, Tang, Jianshe, Naik, Mehul, Kesapragada, Sree, Ayyagari-Sangamali, Buvna, Bazizi, El Mehdi, Tang, Xianmin
Published in 2023 International Electron Devices Meeting (IEDM) (09.12.2023)
Published in 2023 International Electron Devices Meeting (IEDM) (09.12.2023)
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Conference Proceeding
3D MOSCAP Vehicle for Electrical Characterization of Sidewall Dielectrics for 3D Monolithic Integration
Wood, Bingxi, McDougall, Brendan, Chan, Osbert, Dent, Alan, Ni, Chi-Nung, Hung, Raymond, Chen, Hao, Xu, Ping, Nguyen, Phong, Okazaki, Motoya, Mao, Daxin, Xu, Xumou, Ramiraz, Ricardo, Cai, Man-Ping, Jin, Miao, Lee, Won, Noori, Atif, Shek, Meiyee, Chang, Chorng-Ping
Published in ECS transactions (01.01.2011)
Published in ECS transactions (01.01.2011)
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Journal Article
Flowable CVD Film Defect Reduction
Li, Wenhui, Jha, Praket P, Cai, Man-Ping, Tsiang, Michael Wenyoung, Liang, Jingmei, Pandit, Mandar B
Year of Publication 24.11.2022
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Year of Publication 24.11.2022
Patent
Growth and Etch Forms of Germanium Microcrystals on a Silicon Oxide Substrate
Huang, Yi-Chiau, Cai, Man-Ping, Zhou, Hongwen, Chung, Hua
Published in Meeting abstracts (Electrochemical Society) (01.09.2016)
Published in Meeting abstracts (Electrochemical Society) (01.09.2016)
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Journal Article
SYSTEMS AND METHODS FOR ANALYZING DEFECTS IN CVD FILMS
LI, Wenhui, CAI, Man-Ping, TSIANG, Michael, JHA, Praket, LENG, Jingmin, PANDIT, Mandar B
Year of Publication 21.04.2022
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Year of Publication 21.04.2022
Patent
SYSTEMS AND METHODS FOR ANALYZING DEFECTS IN CVD FILMS
Li, Wenhui, Cai, Man-Ping, Jha, Praket Prakash, Tsiang, Michael Wenyoung, Pandit, Mandar B, Leng, Jingmin
Year of Publication 14.04.2022
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Year of Publication 14.04.2022
Patent
FLOWABLE CVD FILM DEFECT REDUCTION
LI, Wenhui, CAI, Man-Ping, JHA, Praket P, LIANG, Jingmei, TSIANG, Michael Wenyoung, PANDIT, Mandar B
Year of Publication 24.11.2022
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Year of Publication 24.11.2022
Patent
DUV inspection and defect origin analysis for 22nm spacer self-aligned double-patterning
Montal, Ofir, Dotan, Kfir, Mebarki, Bencherki, Cai, Man-Ping, Ngai, Chris
Published in Solid state technology (01.07.2010)
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Published in Solid state technology (01.07.2010)
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Protein sequence analysis based on hydropathy profile of amino acids
Xie, Xiao-li, Zheng, Li-fei, Yu, Ying, Liang, Li-ping, Guo, Man-cai, Song, John, Yuan, Zhi-fa
Published in Journal of Zhejiang University. B. Science (01.02.2012)
Published in Journal of Zhejiang University. B. Science (01.02.2012)
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Journal Article
Semiconductor processing methods and systems
LI, WEN-HUI, JHA, PRAKET PRAKASH, PANDIT, MANDAR B, CAI, MAN-PING, LENG, JINGMIN, TSIANG, MICHAEL WENYOUNG
Year of Publication 11.08.2023
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Year of Publication 11.08.2023
Patent