Mechanical Properties of Sintered Ag as a New Material for Die Bonding: Influence of the Density
Caccuri, V., Milhet, X., Gadaud, P., Bertheau, D., Gerland, M.
Published in Journal of electronic materials (01.12.2014)
Published in Journal of electronic materials (01.12.2014)
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Journal Article
Evolution of the nanoporous microstructure of sintered Ag at high temperature using in-situ X-ray nanotomography
Milhet, X., Nait-Ali, A., Tandiang, D., Liu, Y.-J., Van Campen, D., Caccuri, V., Legros, M.
Published in Acta materialia (01.09.2018)
Published in Acta materialia (01.09.2018)
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Journal Article
Mechanical Properties of Sintered Ag as a New Material for Die Bonding: Influence of the Density : Pb-FREE SOLDERS AND MATERIALS FOR EMERGING INTERCONNECT AND PACKAGING TECHNOLOGIES
CACCURI, V, MILHET, X, GADAUD, P, BERTHEAU, D, GERLAND, M
Published in Journal of electronic materials (2014)
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Published in Journal of electronic materials (2014)
Journal Article