CMP MICRO-LAYER CMP POLISHING SUBPAD
HOU GUANHUA, WANG TECHUN, ALSBAIEE ALAAEDDIN, CREVASSE ANNETTE M, WANK ANDREW, MCCORMICK JOHN R, VASQUEZ NESTOR A, BARTON BRYAN E
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Year of Publication 10.06.2024
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Polishing surface temperature conditioning system for a chemical mechanical planarization process
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Year of Publication 04.02.2002
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Year of Publication 04.02.2002
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MICRO-LAYER CMP POLISHING SUBPAD
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Year of Publication 06.06.2024
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Method of eliminating agglomerate particles in a polishing slurry
Crevasse, Annette M, Easter, William G, Maze, John A, Merchant, Sailesh M, Miceli, Frank
Year of Publication 15.06.2004
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Year of Publication 15.06.2004
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Method of eliminating agglomerate particles in a polishing slurry
MICELI FRANK, EASTER WILLIAM G, CREVASSE ANNETTE M, MERCHANT SAILESH M, MAZE JOHN A
Year of Publication 15.06.2004
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Year of Publication 15.06.2004
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System and method of determining a polishing endpoint by monitoring signal intensity
Crevasse, Annette M, Easter, William G, Miceli, Frank, Yang, Yifeng Winston
Year of Publication 04.05.2004
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Year of Publication 04.05.2004
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System and method of determining a polishing endpoint by monitoring signal intensity
MICELI FRANK, EASTER WILLIAM G, CREVASSE ANNETTE M, YANG YIFENG WINSTON
Year of Publication 04.05.2004
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Year of Publication 04.05.2004
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