A D-Band Transmitter Achieving 57.6-Gb/s and 30-dBm EIRP Based on Channel-Aggregation 45-Nm ICs and a Low-Profile Flat Lens Antenna
Gonzalez-Jimenez, Jose Luis, Manzillo, Francesco Foglia, Hamani, Abdelaziz, Siligaris, Alexandre, Cassiau, Nicolas, Clemente, Antonio, Courouve, Pierre, Chaix, Fabrice, Dehos, Cedric
Published in IEEE transactions on microwave theory and techniques (01.01.2024)
Published in IEEE transactions on microwave theory and techniques (01.01.2024)
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Journal Article
Artificial-Intelligence-Driven RF Carrier Aggregation Filter For 6G Application
Courouve, Pierre, Al Shakoush, Ali, Dehos, Cedric, Ouvry, Laurent
Published in 2024 IEEE International Symposium on Circuits and Systems (ISCAS) (19.05.2024)
Published in 2024 IEEE International Symposium on Circuits and Systems (ISCAS) (19.05.2024)
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Conference Proceeding
A 57.6 Gb/s Wireless Link based on 26.4 dBm EIRP D-band Transmitter Module and a Channel Bonding Chipset on CMOS 45nm
Gonzalez-Jimenez, Jose Luis, Siligaris, Alexandre, Hamani, Abdelaziz, Foglia-Manzillo, Francesco, Courouve, Pierre, Cassiau, Nicolas, Dehos, Cedric, Clemente, Antonio
Published in 2023 IEEE Radio Frequency Integrated Circuits Symposium (RFIC) (11.06.2023)
Published in 2023 IEEE Radio Frequency Integrated Circuits Symposium (RFIC) (11.06.2023)
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Conference Proceeding
An Energy-Efficient 56-Gb/s D-Band TX-to-RX Link Using CMOS ICs and Transmitarray Antennas
Gonzalez-Jimenez, J. L., Siligaris, A., Hamani, A., Manzillo, F. Foglia, Courouve, P., Cassiau, N., Dehos, C., Clemente, A.
Published in IEEE microwave and wireless technology letters (Print) (01.06.2024)
Published in IEEE microwave and wireless technology letters (Print) (01.06.2024)
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Journal Article
D-band channel aggregation receiver architecture based on IF analog processing using digital wavelet
Dehos, Cedric, Gulfo, Jorge-Luis Monsalve, Lachartre, David, Belot, Didier, Courouve, Pierre, Pelissier, Michael
Published in 2022 29th IEEE International Conference on Electronics, Circuits and Systems (ICECS) (24.10.2022)
Published in 2022 29th IEEE International Conference on Electronics, Circuits and Systems (ICECS) (24.10.2022)
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Conference Proceeding
A 42.24 Gb/s Channel Bonding Up-Converter with integrated multi-LO generation in 45nm CMOS
Siligaris, A., Courouve, P., Waltener, G., Hamani, A., Dehos, C., Gonzalez-Jimenez, J. L.
Published in 2023 IEEE 23rd Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems (22.01.2023)
Published in 2023 IEEE 23rd Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems (22.01.2023)
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Conference Proceeding