by Haring, Ruud A., Ohmacht, Martin, Fox, Thomas W., Gschwind, Michael K., Satterfield, David L., Sugavanam, Krishnan, Coteus, Paul W., Heidelberger, Philip, Blumrich, Matthias A., Wisniewski, Robert W., Gara, Alan, Chiu, George Liang-Tai, Boyle, Peter A., Chist, Norman H., Changhoan Kim
Published in IEEE MICRO (01.03.2012)

by Chang, Leland, Frank, David J., Montoye, Robert K., Koester, Steven J., Ji, Brian L., Coteus, Paul W., Dennard, Robert H., Haensch, Wilfried
Published in Proceedings of the IEEE (01.02.2010)

by Kyu-hyoun Kim, Hoe-Ju Chung, Woo-Seop Kim, Moonsook Park, Jang, Y.-C., Jin-Young Kim, Hwan-Wook Park, Uksong Kang, Coteus, P.W., Joo Sun Choi, Changhyun Kim
Published in IEEE journal of solid-state circuits (01.01.2007)

by Deutsch, A., Kopcsay, G.V., Coteus, P.W., Surovic, C.W., Dahlen, P.E., Heckmann, D.L., Dah-Weih Duan
Published in IEEE transactions on electromagnetic compatibility (01.11.2001)

by KIM, KYU HYOUN, COTEUS PAUL W
Year of Publication 19.05.2010

Published in IBM journal of research and development (01.01.2008)

by MOSKOWITZ, PAUL A, COTEUS, PAUL W, BRADY, MICHAEL J
Year of Publication 15.06.1999

by CHANG, Leland, FRANK, David J, MONTOYE, Robert K, KOESTER, Steven J, JI, Brian L, COTEUS, Paul W, DENNARD, Robert H, HAENSCH, Wilfried
Published in Proceedings of the IEEE (2010)

by Deutsch, A., Kopcsay, G.V., Restle, P.J., Smith, H.H., Katopis, G., Becker, W.D., Coteus, P.W., Surovic, C.W., Rubin, B.J., Dunne, R.P., Gallo, T., Jenkins, K.A., Terman, L.M., Dennard, R.H., Sai-Halasz, G.A., Krauter, B.L., Knebel, D.R.
Published in IEEE transactions on microwave theory and techniques (01.10.1997)

by Kim, Kyu-hyoun, Coteus, Paul W., Dreps, Daniel, Kim, Seongwon, Rylov, Sergey V., Friedman, Daniel J.
Published in 2008 IEEE International Solid-State Circuits Conference - Digest of Technical Papers (01.02.2008)

by Blackshear, Edmund, Cipolla, Thomas, Kim, Kyu-hyoun, Coteus, Paul W
Year of Publication 24.05.2022

by Acun, Bilge, Lee, Eun Kyung, Park, Yoonho, Coteus, Paul W
Year of Publication 17.05.2022

by Blackshear, Edmund, Cipolla, Thomas, Kim, Kyu-hyoun, Coteus, Paul W
Year of Publication 09.12.2021

by Deutsch, A., Kopcsay, G.V., Surovic, C.W., Coteus, P.W., Lanzetta, A.P., Takken, T., Bond, P.W.
Published in IEEE transactions on advanced packaging (01.02.2002)

by Tian, Shurong, Coteus, Paul W, Schultz, Mark D, Takken, Todd E
Year of Publication 08.11.2022

by Acun, Bilge, Lee, Eun Kyung, Park, Yoonho, Coteus, Paul W
Year of Publication 05.03.2020

by Sugawara, Yutaka, Chen, Dong, Coteus, Paul W, Heidelberger, Philip
Year of Publication 13.02.2020

by Zhang, Xin, Ferencz, Andrew, Coteus, Paul W, Takken, Todd E
Year of Publication 13.08.2019

by Zhang, Xin, Ferencz, Andrew, Coteus, Paul W, Takken, Todd E
Year of Publication 30.05.2019

by Hall, Shawn A, Ferencz, Andrew, Coteus, Paul W, Takken, Todd E
Year of Publication 10.11.2020