COPPER ELECTRODEPOSITION IN MICROELECTRONICS
WHITTEN KYLE, ROUYA ERIC, PANECCASIO VINCENT, HURTUBISE RICHARD, COMMANDER JOHN
Year of Publication 21.06.2021
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Year of Publication 21.06.2021
Patent
마이크로전자장치에서의 구리 전착
WHITTEN KYLE, ROUYA ERIC, PANECCASIO VINCENT, HURTUBISE RICHARD, COMMANDER JOHN
Year of Publication 24.05.2019
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Year of Publication 24.05.2019
Patent
COBALT FILLING OF INTERCONNECTS IN MICROELECTRONICS
PANECCASIO JR. VINCENT, HAN JIANWEN, ROUYA ERIC, WHITTEN KYLE, SUN SHAOPENG, COMMANDER JOHN
Year of Publication 29.07.2020
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Year of Publication 29.07.2020
Patent
집적 회로의 웨이퍼 레벨 패키징에서의 구리 침착
WHITTEN KYLE, PANECCASIO VINCENT JR, HURTUBISE RICHARD, COMMANDER JOHN, RICHARDSON THOMAS
Year of Publication 10.07.2019
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Year of Publication 10.07.2019
Patent
상호접속부의 코발트 충전
YAKOBSON ERIC, NAJJAR ELIE, HAN JIANWEN, WHITTEN KYLE, SUN SHAOPENG, PANECCASIO VINCENT JR, COMMANDER JOHN
Year of Publication 29.04.2020
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Year of Publication 29.04.2020
Patent
ELECTRODEPOSITION OF COPPER
WHITTEN KYLE, ROUYA ERIC, PANECCASIO VINCENT, HURTUBISE RICHARD, COMMANDER JOHN
Year of Publication 29.07.2016
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Year of Publication 29.07.2016
Patent
마이크로일렉트로닉스 내의 상호연결들의 코발트 충진
PANECCASIO JR. VINCENT, ROUYA ERIC, WHITTEN KYLE, SUN SHAOPENG, COMMANDER JOHN
Year of Publication 06.03.2018
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Year of Publication 06.03.2018
Patent
Single-bundle anterior cruciate ligament reconstruction: technique overview and comprehensive review of results
Rue, John-Paul H, Lewis, Paul B, Parameswaran, A Dushi, Bach, Jr, Bernard R
Published in Journal of bone and joint surgery. American volume (01.11.2008)
Published in Journal of bone and joint surgery. American volume (01.11.2008)
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Journal Article
Copper Electrodeposition in Microelectronics
Commander, John, Rouya, Eric, Whitten, Kyle, Paneccasio, JR., Vincent, Hurtubise, Richard
Year of Publication 18.01.2024
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Year of Publication 18.01.2024
Patent
The problem of drug diversion
Burke, Commander John J
Published in International journal of pharmaceutical compounding (01.01.2002)
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Published in International journal of pharmaceutical compounding (01.01.2002)
Journal Article
COBALT FILLING OF INTERCONNECTS IN MICROELECTRONICS
PANECCASIO, JR., Vincent, WHITTEN, Kyle, SUN, Shaopeng, COMMANDER, John, ROUYA, Eric, HAN, Jianwen
Year of Publication 13.09.2023
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Year of Publication 13.09.2023
Patent
COBALT FILLING OF INTERCONNECTS IN MICROELECTRONICS
WHITTEN, Kyle, SUN, Shaopeng, PANECCASIO, JR Vincent, COMMANDER, John, ROUYA, Eric, HAN, Jianwen
Year of Publication 19.07.2023
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Year of Publication 19.07.2023
Patent
Copper deposition in wafer level packaging of integrated circuits
Commander, John, Whitten, Kyle, Paneccasio, Jr., Vincent, Richardson, Thomas, Hurtubise, Richard
Year of Publication 11.07.2023
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Year of Publication 11.07.2023
Patent
COBALT FILLING OF INTERCONNECTS
WHITTEN, Kyle, SUN, Shaopeng, NAJJAR, Elie, COMMANDER, John, YAKOBSON, Eric, PANECCASIO, Vincent, Jr, HAN, Jianwen
Year of Publication 11.01.2023
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Year of Publication 11.01.2023
Patent
Cobalt filling of interconnects in microelectronics
Commander, John, Rouya, Eric, Han, Jianwen, Whitten, Kyle, Paneccasio, Jr., Vincent, Sun, Shaopeng
Year of Publication 06.09.2022
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Year of Publication 06.09.2022
Patent
Cobalt filling of interconnects
Commander, John, Han, Jianwen, Whitten, Kyle, Najjar, Elie, Paneccasio, Jr., Vincent, Yakobson, Eric, Sun, Shaopeng
Year of Publication 02.08.2022
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Year of Publication 02.08.2022
Patent
COPPER ELECTRODEPOSITION IN MICROELECTRONICS
PANECCASIO, Vincent, WHITTEN, Kyle, COMMANDER, John, HURTUBISE, Richard, ROUYA, Eric
Year of Publication 21.10.2020
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Year of Publication 21.10.2020
Patent
Copper Deposition in Wafer Level Packaging of Integrated Circuits
Commander, John, Whitten, Kyle, Richardson, Thomas, Paneccasio, JR., Vincent, Hurtubise, Richard
Year of Publication 16.12.2021
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Year of Publication 16.12.2021
Patent
Copper deposition in wafer level packaging of integrated circuits
Commander, John, Whitten, Kyle, Paneccasio, Jr., Vincent, Richardson, Thomas, Hurtubise, Richard
Year of Publication 21.09.2021
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Year of Publication 21.09.2021
Patent