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"COBBLEY, CHAD"
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"COBBLEY, CHAD"
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Techniques for packaging multiple device components
by
Bolken Todd O
,
Cobbley Chad
A
Year of Publication
31.01.2017
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Process for providing electrical connection between a semiconductor die and a semiconductor die receiving member
by
COBBLEY CHAD
Year of Publication
08.02.2005
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Process for providing electrical connection between a semiconductor die and a semiconductor die receiving member
by
Cobbley
,
Chad
Year of Publication
08.02.2005
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Semiconductor device structures and electronic devices including hybrid conductive vias, and methods of fabrication
by
COBBLEY CHAD
A
,
GREENWOOD JONATHON G
Year of Publication
28.10.2014
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Semiconductor device including one or more stiffening elements
by
COBBLEY CHAD
A
,
BAERLOCHER CARY J
Year of Publication
06.05.2014
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TECHNIQUES FOR PACKAGING MULTIPLE DEVICE COMPONENTS
by
BOLKEN TODD O
,
COBBLEY CHAD
A
Year of Publication
10.04.2014
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Techniques for packaging multiple device components
by
BOLKEN TODD O
,
COBBLEY CHAD
A
Year of Publication
14.01.2014
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Methods of fabrication of package assemblies for optically interactive electronic devices and package assemblies therefor
by
BOLKEN TODD O
,
COBBLEY CHAD
A
Year of Publication
07.01.2014
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Substrate for accepting wire bonded or flip-chip components
by
COBBLEY CHAD
Year of Publication
31.12.2002
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Substrate for accepting wire bonded or flip-chip components
by
Cobbley
,
Chad
Year of Publication
31.12.2002
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METHODS OF FABRICATION OF PACKAGE ASSEMBLIES FOR OPTICALLY INTERACTIVE ELECTRONIC DEVICES AND PACKAGE ASSEMBLIES THEREFOR
by
BOLKEN TODD O
,
COBBLEY CHAD
A
Year of Publication
12.09.2013
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SEMICONDUCTOR DEVICE STRUCTURES AND ELECTRONIC DEVICES INCLUDING SAME HYBRID CONDUCTIVE VIAS, AND METHODS OF FABRICATION
by
COBBLEY CHAD
A
,
GREENWOOD JONATHON G
Year of Publication
25.07.2013
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Process for providing electrical connection between a semiconductor die and a semiconductor die receiving member
by
Cobbley
,
Chad
Year of Publication
13.06.2002
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Process for providing electrical connection between a semiconductor die and a semiconductor die receiving member
by
COBBLEY CHAD
Year of Publication
13.06.2002
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Methods of fabrication of package assemblies for optically interactive electronic devices and package assemblies therefor
by
BOLKEN TODD O
,
COBBLEY CHAD
A
Year of Publication
23.04.2013
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Process for providing electrical connection between a semiconductor die and a semiconductor die receiving member
by
COBBLEY CHAD
Year of Publication
18.12.2001
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Method of encapsulating packaged microelectronic devices with a barrier
by
COBBLEY CHAD
A
Year of Publication
19.02.2008
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Method of encapsulating packaged microelectronic devices with a barrier
by
Cobbley
,
Chad
A
Year of Publication
19.02.2008
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Semiconductor device structures and electronic devices including same hybrid conductive vias
by
COBBLEY CHAD
A
,
GREENWOOD JONATHON G
Year of Publication
01.01.2013
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Semiconductor device structures and electronic devices including same hybrid conductive vias
by
Cobbley
,
Chad
A
,
Greenwood, Jonathon G
Year of Publication
01.01.2013
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