Search Results - "CHUNG SHENG-FENG" :: K.UTB vyhledávací portál | TBU Library Retrieval Portal

Conductive and Transparent Properties of ZnO/Cu/ZnO Sandwich Structure

Conductive and Transparent Properties of ZnO/Cu/ZnO Sandwich Structure

by Chen, Wei-Hao, Chou, Chia-Yueh, Li, Bao-Jhen, Yeh, Ching-Yu, Huang, Bo-Rong, Hsu, Mao-Feng, Chung, Sheng-Feng, Liu, Cheng-Yi
Published in Journal of electronic materials (01.03.2021)

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Journal Article

High stretchability and conductive stability of flexible hybrid electronic materials for smart clothing

High stretchability and conductive stability of flexible hybrid electronic materials for smart clothing

by Li, Jia-Wun, Huang, Chen-Yang, Zhou, Bo-Hong, Hsu, Mao-Feng, Chung, Sheng-Feng, Lee, Wei-Chung, Tsai, Wei-Yi, Chiu, Chih-Wei
Published in Chemical engineering journal advances (15.11.2022)

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Journal Article

Communication-Synthesis of Highly-Branched Silver Nanocrystals for EMI Shielding Applications

Communication-Synthesis of Highly-Branched Silver Nanocrystals for EMI Shielding Applications

by Pai, Ying-Hao, Hsu, Mao-Feng, Chung, Sheng-Feng, Huang, Chi-Fei, Chu, Yu-Cheng, Lin, Hung-Chieh, Chen, Chun-Hua
Published in Journal of the Electrochemical Society (01.01.2021)

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Journal Article

High Luminescence Polarized Polymer Light-Emitting Diodes Fabricated Using Aligned Polyfluorene

High Luminescence Polarized Polymer Light-Emitting Diodes Fabricated Using Aligned Polyfluorene

by Chung, Sheng-Feng, Wen, Ten-Chin, Chou, Wei-Yang, Guo, Tzung-Fang
Published in Japanese Journal of Applied Physics (01.01.2006)

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Journal Article

Influence of dopant size on the junction properties of polyaniline

Influence of dopant size on the junction properties of polyaniline

by Chung, Sheng-Feng, Wen, Ten-Chin, Gopalan, A.
Published in Materials science & engineering. B, Solid-state materials for advanced technology (25.01.2005)

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Journal Article

The extensibility of poly(diphenylamine) monolayer at air/liquid interface

The extensibility of poly(diphenylamine) monolayer at air/liquid interface

by CHUNG, Sheng-Feng, LEE, Yuh-Lang, WEN, Ten-Chin
Published in Thin solid films (22.12.2005)

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Journal Article

CIRCUIT PRINTING DEVICE, CIRCUIT PRINTING METHOD AND CIRCUIT STRUCTURE MANUFACTURED BY PRINTING METHOD

CIRCUIT PRINTING DEVICE, CIRCUIT PRINTING METHOD AND CIRCUIT STRUCTURE MANUFACTURED BY PRINTING METHOD

by CHUNG SHENG FENG, SHIH CHENG-YI, WEI YUI JIE, LU SU TSAI, ZHANG SHU YI, RIN SEMEI
Year of Publication 31.08.2017

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Patent

SENSING STRUCTURE AND PRINTING METHOD THEREOF

SENSING STRUCTURE AND PRINTING METHOD THEREOF

by CHUNG SHENG FENG, LU SU TSAI, SHA GYOKURYO, SAKATA ORA, ABE KEIICHI, SANO HIROYUKI, HAGISAKA WATARU
Year of Publication 22.03.2016

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Patent

MULTI-DIE PACKAGE

MULTI-DIE PACKAGE

by Chung, Sheng-Feng
Year of Publication 13.04.2023

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Patent

STRETCHABLE ELECTROCONDUCTIVE MATERIAL, METHOD FOR MANUFACTURING THE SAME, AND DEVICE USING THE STRETCHABLE ELECTROCONDUCTIVE MATERIAL

STRETCHABLE ELECTROCONDUCTIVE MATERIAL, METHOD FOR MANUFACTURING THE SAME, AND DEVICE USING THE STRETCHABLE ELECTROCONDUCTIVE MATERIAL

by CHUNG, SHENG-FENG, HUANG, CHI-FEI
Year of Publication 25.05.2023

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Patent

LIQUID CRYSTAL-LIKE DIAMINE MONOMER AND METHOD FOR MANUFACUTURING THE SAME, MODIFIED POLYIMIDE AND METHOD FOR MANUFACUTURING THE SAME

LIQUID CRYSTAL-LIKE DIAMINE MONOMER AND METHOD FOR MANUFACUTURING THE SAME, MODIFIED POLYIMIDE AND METHOD FOR MANUFACUTURING THE SAME

by CHUNG, SHENG-FENG
Year of Publication 01.05.2024

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Patent

Chip package module including flip-chip ground pads and power pads, and wire-bonding ground pads and power pads

Chip package module including flip-chip ground pads and power pads, and wire-bonding ground pads and power pads

by Chung, Sheng-Feng, Chu, Cheng-Lun
Year of Publication 23.08.2022

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Patent

Multi-die package

Multi-die package

by CHUNG, SHENG-FENG
Year of Publication 16.04.2023

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Patent

Method for manufacturing electromagnetic shielding film

Method for manufacturing electromagnetic shielding film

by Huang, Chi-Fei, Chung, Sheng-Feng, Yen, Chen-Feng
Year of Publication 06.06.2023

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Patent

Elastic conductive composite fabric capable of detecting and providing electrical signals according to reflections of limbs and body movements

Elastic conductive composite fabric capable of detecting and providing electrical signals according to reflections of limbs and body movements

by Huang, Chi-Fei, Chung, Sheng-Feng, Hsiang, Shou-Jui
Year of Publication 14.03.2023

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Patent

CHIP PACKAGE MODULE

CHIP PACKAGE MODULE

by CHU, CHENG-LUN, CHUNG, SHENG-FENG
Year of Publication 08.04.2021

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Patent

Multi-die package

Multi-die package

by CHUNG, SHENG-FENG
Year of Publication 21.06.2022

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Patent

METHOD FOR MANUFACTURING ELECTROMAGNETIC SHIELDING FILM

METHOD FOR MANUFACTURING ELECTROMAGNETIC SHIELDING FILM

by CHUNG, SHENG-FENG, HUANG, CHI-FEI, YEN, CHEN-FENG
Year of Publication 03.02.2022

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Patent

CONDUCTIVE INK AND CONDUCTIVE ELEMENT ABLE TO BE STRETCHED

CONDUCTIVE INK AND CONDUCTIVE ELEMENT ABLE TO BE STRETCHED

by CHUNG, SHENG-FENG, SU, LING-LUNG
Year of Publication 11.11.2021

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Patent

ELASTIC CONDUCTIVE COMPOSITE FABRIC CAPABLE OF DETECTING AND PROVIDING ELECTRICAL SIGNALS ACCORDING TO REFLECTIONS OF LIMBS AND BODY MOVEMENTS

ELASTIC CONDUCTIVE COMPOSITE FABRIC CAPABLE OF DETECTING AND PROVIDING ELECTRICAL SIGNALS ACCORDING TO REFLECTIONS OF LIMBS AND BODY MOVEMENTS

by CHUNG, SHENG-FENG, HSIANG, SHOU-JUI, HUANG, CHI-FEI
Year of Publication 29.10.2020

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Patent