Electromigration and Thermomigration Characteristics in Flip Chip Sn-3.5Ag Solder Bump
Lee, Jang-Hee, Lim, Gi-Tae, Yang, Seung-Taek, Suh, Min-Suk, Chung, Qwan-Ho, Byun, Kwang-Yoo, Park, Young-Bae
Published in Journal of the Korean Institute of Metals and Materials (01.05.2008)
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Published in Journal of the Korean Institute of Metals and Materials (01.05.2008)
Journal Article
Size effect on electromigration reliability of pb-free flip chip solder bump
Jang-Hee Lee, Gi-Tae Lim, Young-Bae Park, Seung-Taek Yang, Min-Suk Suh, Qwan-Ho Chung, Kwang-Yoo Byun
Published in 2008 58th Electronic Components and Technology Conference (01.05.2008)
Published in 2008 58th Electronic Components and Technology Conference (01.05.2008)
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Conference Proceeding
EMBEDDED PACKAGE AND METHOD OF FABRICATING THE SAME
KIM, SEUNG JEE, NAM, JONG HYUN, LEE, SANG YONG, CHUNG, QWAN HO, KIM, SI HAN
Year of Publication 23.12.2014
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Year of Publication 23.12.2014
Patent