Joule Heating Effect on the Electromigration Lifetimes and Failure Mechanisms of Sn-3.5Ag Solder Bump
Jang-Hee Lee, Yong-Duk Lee, Young-Bae Park, Seung-Taek Yang, Min-Suk Suh, Qwan-Ho Chung, Kwang-Yoo Byun
Published in 2007 Proceedings 57th Electronic Components and Technology Conference (01.05.2007)
Published in 2007 Proceedings 57th Electronic Components and Technology Conference (01.05.2007)
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Conference Proceeding
Reliability issues on the high speed DRAM flip-chip package using gold stud bump, lead free solder, and underfill
Woong Sun Lee, Myoung Geun Park, Il Whan Cho, Sung Chul Kim, Ki Young Kim, Qwan Ho Chung, Kwang Yoo Byun
Published in 2008 58th Electronic Components and Technology Conference (01.05.2008)
Published in 2008 58th Electronic Components and Technology Conference (01.05.2008)
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Conference Proceeding