Metallic encapsulation material for organic light emitting diodes and method for preparing the same
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Year of Publication 01.07.2023
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Year of Publication 01.07.2023
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Leveling agent and electroplating composition for forming circuit pattern including the same
KO, NAK-EUN, CHUN, SUNG-WOOK, SIM, JU-YONG, CHUNG, BO-MOOK, KIM, DAE-GEUN
Year of Publication 01.04.2023
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Year of Publication 01.04.2023
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Release layer for metal foil with carrier and metal foil comprising the same
KO, NAK EUN, CHUNG, BO MOOK, KIM, DAE GEUN, PARK, MYONG WHAN, SIM, JU YONG, CHUN, SUNG WOOK
Year of Publication 11.03.2023
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Year of Publication 11.03.2023
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Leveling agent and electrolytic composition for filling via hole
KO, NAK-EUN, KIM, DEA-GEUN, CHUN, SUNG-WOOK, SIM, JU-YONG, CHUNG, BO-MOOK
Year of Publication 01.02.2023
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Year of Publication 01.02.2023
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Leveling agent and electrolytic composition for filling via hole
KO, NAK-EUN, KIM, DEA-GEUN, CHUN, SUNG-WOOK, SIM, JU-YONG, CHUNG, BO-MOOK
Year of Publication 01.02.2023
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Year of Publication 01.02.2023
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Release layer for metal foil with carrier and metal foil comprising the same
KO, NAK-EUN, CHUN, SUNG-WOOK, SIM, JU-YONG, CHUNG, BO-MOOK, KIM, DAE-GEUN, PARK, MYONG-WHAN
Year of Publication 16.09.2022
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Year of Publication 16.09.2022
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Metal foil, carrier with metal foil comprising the same and printed circuit board comprising the same
KO, NAK-EUN, CHUN, SUNG-WOOK, SIM, JU-YONG, CHUNG, BO-MOOK, KIM, DAE-GEUN, PARK, MYONG-WHAN
Year of Publication 16.08.2022
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Year of Publication 16.08.2022
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A leveling agent and an electroplating composition including the same
KO, NAK-EUN, KIM, DEA-GEUN, SEOK, SEONG-HO, CHUN, SUNG-WOOK, SIM, JU-YONG, CHUNG, BO-MOOK, KIM, JOO-SOK
Year of Publication 01.06.2023
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Year of Publication 01.06.2023
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METAL FOIL CARRIER WITH METAL LAYER COMPRISING THE SAME AND PRINTED CIRCUIT BOARD COMPRISING THE SAME
NAKEUN KO, PARK MYONG WHAN, CHUNG BO MOOK, KIM DAE GEUN, SIM JUYONG, CHUN, SUNG WOOK
Year of Publication 18.12.2023
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Year of Publication 18.12.2023
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Leveler for non-sulfuric acid electroplating and electroplating composition containing the same
KANG JINSEOK, KIM JEONG KYU, CHUNG BO MOOK, KO NAK EUN, KIM DAE GEUN, CHUN, SUNG WOOK, JEON HYUNWOO
Year of Publication 07.08.2024
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Year of Publication 07.08.2024
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