Effect of microelements addition on the interfacial reaction between Sn-Ag-Cu solders and the Cu substrate
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Conference Proceeding
Journal Article
Mechanical strength of Sn-3.5Ag-based solders and related bondings
CHUANG, Chiang-Ming, SHIH, Po-Cheng, LIN, Kwang-Lung
Published in Journal of electronic materials (01.01.2004)
Published in Journal of electronic materials (01.01.2004)
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Journal Article
Failure behavior upon shear test of 5Sn–95Pb solder bump after high temperature reliability test
Liu, Yeh-Hsiu, Chuang, Chiang-Ming, Lin, Kwang-Lung
Published in Journal of materials research (01.08.2004)
Published in Journal of materials research (01.08.2004)
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Journal Article
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME
LEE CHIH MING, LIU CHIEN HSUAN, CHUANG CHIANG MING, CHUANG KUN TSANG, LIAO HUNG CHE, CHEN HSIN CHI
Year of Publication 28.04.2017
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Year of Publication 28.04.2017
Patent
The interfacial reaction between Sn-Zn-Ag-Ga-Al solders and metallized Cu substrates
CHUANG, Chiang-Ming, HUNG, Hui-Tzu, LIU, Pei-Chi, LIN, Kwang-Lung
Published in Journal of electronic materials (01.01.2004)
Published in Journal of electronic materials (01.01.2004)
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Journal Article
The Interfacial Reaction between Sn-Zn-Ag-Ga-AI Solders and Metallized Cu Substrates
Chiang-Ming, Chuang, Hung, Hui-Tzu, Pei-Chi, Liu, Kwang-Lung, Lin
Published in Journal of electronic materials (01.01.2004)
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Published in Journal of electronic materials (01.01.2004)
Journal Article
Semiconductor device having a wall structure surrounding a stacked gate structure
Chuang, Chiang-Ming, Liao, Hung-Che, Lee, Chih-Ming, Liu, Chien-Hsuan, Chuang, Kun-Tsang, Chen, Hsin-Chi, Pan, Chia-Ming
Year of Publication 05.03.2024
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Year of Publication 05.03.2024
Patent