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Method for encapsulating lead frame packages
by
CHUAN LAU K
,
HENG WONG C
,
SIANG GOH K
,
SANG YIP C
,
LUM RICHARD YEE M
Year of Publication
29.12.2005
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Patent
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chemistry
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basic electric elements
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electric solid state devices not otherwise provided for
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electricity
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semiconductor devices
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esp@cenet
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