Search Results - "CHU Kunmo" :: K.UTB vyhledávací portál

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A comparative study of Cn/Sn/Cu and Ni/Sn/Ni solder joints for low temperature stable transient liquid phase bonding

by Chu, Kunmo, Sohn, Yoonchul, Moon, Changyoul
Published in Scripta materialia (01.12.2015)

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Prediction of Interfacial Reaction Between Cu and In During Low-Temperature Soldering

by Oh, Sang-Ho, Chu, Kunmo, Lee, Byeong-Joo
Published in Journal of phase equilibria and diffusion (01.12.2022)

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Electrical and Thermal Properties of Carbon-Nanotube Composite for Flexible Electric Heating-Unit Applications

by CHU, Kunmo, KIM, Dongouk, SOHN, Yoonchul, LEE, Sangeui, MOON, Changyoul, PARK, Sunghoon
Published in IEEE electron device letters (01.05.2013)

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Study of electric heating effects on carbon nanotube polymer composites

by KUNMO CHU, YUN, Dong-Jin, DONGOUK KIM, HYOKEUN PARK, PARK, Sung-Hoon
Published in Organic electronics (01.11.2014)

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Fabrication of a Hybrid Carbon-Based Composite for Flexible Heating Element With a Zero Temperature Coefficient of Resistance

by Chu, Kunmo, Park, Sung-Hoon
Published in IEEE electron device letters (01.01.2015)

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Resistance Complemented Carbon-Nanotube Composite for Laser Printer Fusers Element

by Chu, Kunmo, Sohn, Yoonchul, Park, Sung-Hoon
Published in IEEE electron device letters (01.09.2016)

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Effect of multiple flip-chip assembly on the mechanical reliability of eutectic Au–Sn solder joint

by Chu, Kunmo, Park, Sunghoon, Lee, Changseung, Sohn, Yoonchul
Published in Journal of materials science. Materials in electronics (01.09.2016)

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Carbon Nanotube Nanocomposite Having Segregated Network Structure for Wearable Thermotherapy Application

by Kim, Dongouk, Lee, Sang-Eui, Chu, Kunmo, Park, Sung-Hoon, Sohn, Yoonchul
Published in IEEE electron device letters (01.10.2017)

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Design of multi-functional dual hole patterned carbon nanotube composites with superhydrophobicity and durability

by Park, Sung-Hoon, Cho, Eun-Hyoung, Sohn, Jinseung, Theilmann, Paul, Chu, Kunmo, Lee, Sunghee, Sohn, Yoonchul, Kim, Dongouk, Kim, Byunghoon
Published in Nano research (01.06.2013)

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An Oligoimide Particle as a Pickering Emulsion Stabilizer

by Cho, Yu-Jin, Kim, Dong-Min, Song, In-Ho, Choi, Ju-Young, Jin, Seung-Won, Kim, Beom-Jun, Jeong, Jin-Won, Jang, Chae-Eun, Chu, Kunmo, Chung, Chan-Moon
Published in Polymers (27.09.2018)

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Flexible hybrid conductor comprising eutectic Ga-In liquid metal and Ag nanowires for the application of electronic skin

by Sohn, Yoonchul, Chu, Kunmo
Published in Materials letters (15.04.2020)

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Smart conducting polymer composites having zero temperature coefficient of resistance

by Chu, Kunmo, Lee, Sung-Chul, Lee, Sangeui, Kim, Dongearn, Moon, Changyoul, Park, Sung-Hoon
Published in Nanoscale (14.01.2015)

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Smart Passivation Materials with a Liquid Metal Microcapsule as Self‐Healing Conductors for Sustainable and Flexible Perovskite Solar Cells

by Chu, Kunmo, Song, Byong Gwon, Yang, Hye‐In, Kim, Dong‐Min, Lee, Chang Seung, Park, Minwoo, Chung, Chan‐Moon
Published in Advanced functional materials (30.05.2018)

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Electrical Properties of the Carbon-Nanotube Composites Film Under Extreme Temperature Condition

by Ha, Ji-Hwan, Chu, Kunmo, Park, Sung-Hoon
Published in Journal of nanoscience and nanotechnology (01.03.2019)

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Electrical heating behavior of flexible carbon nanotube composites with different aspect ratios

by Chu, Kunmo, Park, Sung-Hoon
Published in Journal of industrial and engineering chemistry (Seoul, Korea) (25.03.2016)

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Quantitative analysis of nano-defects in thin film encapsulation layer by Cu electrodeposition

by Chu, Kunmo, Bae, Ki Deok, Song, Byong Gwon, Kim, Jaekwan, Park, Yong Young, Xianyu, Wenxu, Lee, Chang Seung, Sohn, Yoonchul
Published in Applied surface science (30.09.2018)

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Effects of Ag addition and Ag 3 Sn formation on the mechanical reliability of Ni/Sn solder joints

by Chu, Kunmo, Lee, Changseung, Park, Sung-Hoon, Sohn, Yoonchul
Published in Microelectronics and reliability (01.08.2017)

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Effects of Ag addition and Ag3Sn formation on the mechanical reliability of Ni/Sn solder joints

by Chu, Kunmo, Lee, Changseung, Park, Sung-Hoon, Sohn, Yoonchul
Published in Microelectronics and reliability (01.08.2017)

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Suppression of negative temperature coefficient of resistance of multiwalled nanotube/silicone rubber composite through segregated conductive network and its application to laser-printing fusing element

by Lee, Sang-Eui, Sohn, Yoonchul, Chu, Kunmo, Kim, Dongouk, Park, Sung-Hoon, Bae, Minjong, Kim, Dongearn, Kim, Yongchurl, Han, InTaek, Kim, Ha-Jin
Published in Organic electronics (01.10.2016)

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Enhancement of optical performance of the light emitting diode packages with advanced thermal design of die-attaching layers

by Chu, Kunmo, Lee, Changseung, Park, Sung-Hoon, Sohn, Yoonchul
Published in Journal of materials science. Materials in electronics (01.04.2017)

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