Bandwidth enhancement in 3DIC CoWoS™ test using direct probe technology
Hao Chen, Jian-Ting Chen, Shang-Ju Lee, Ken Chou, Cheng-Bin Chen, Sen-Kuei Hsu, Hung-Chih Lin, Ching-Nen Peng, Min-Jer Wang
Published in 2012 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) (01.12.2012)
Published in 2012 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) (01.12.2012)
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