Post wirebonding coating for prevention of corrosion of wire bonded packages by chlorine containing foreign particles
Mathew, Varughese, Chopin, Sheila F, Li, Guangming, Xu, Sean
Published in 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (01.05.2022)
Published in 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (01.05.2022)
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Conference Proceeding
Microstructure-Based Stress Modeling of Tin Whisker Growth
Jie-Hua Zhao, Peng Su, Min Ding, Chopin, S., Ho, P.S.
Published in IEEE transactions on electronics packaging manufacturing (01.10.2006)
Published in IEEE transactions on electronics packaging manufacturing (01.10.2006)
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Journal Article
Reaction Kinetics and Rheological Model Coefficient Extraction for Epoxy Mold Compounds
Sakib, A R Nazmus, Jha, Vibhash, Mavinkurve, Amar, Chopin, Sheila
Published in 2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (01.05.2018)
Published in 2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (01.05.2018)
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Conference Proceeding
Effective Stress Relief Without Jeopardizing Reliability in Overmolded Packages with Stress Buffers
Mavinkurve, A., Zaal, Jeroen, Liang, Yukai, Xu, Sean, Storez, Antoine, Guo, Yuan, Teng, Seng, Chopin, Sheila
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)
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Conference Proceeding