Comparison of thermal characteristics of confined and unconfined impinging jets
Choo, Kyo Sung, Kim, Sung Jin
Published in International journal of heat and mass transfer (01.07.2010)
Published in International journal of heat and mass transfer (01.07.2010)
Get full text
Journal Article
Heat transfer characteristics of impinging air jets under a fixed pumping power condition
Choo, Kyo Sung, Kim, Sung Jin
Published in International journal of heat and mass transfer (01.01.2010)
Published in International journal of heat and mass transfer (01.01.2010)
Get full text
Journal Article
Heat transfer characteristics of a micro-scale impinging slot jet
Choo, Kyo Sung, Youn, Young Jik, Kim, Sung Jin, Lee, Dae Hee
Published in International journal of heat and mass transfer (01.06.2009)
Published in International journal of heat and mass transfer (01.06.2009)
Get full text
Journal Article
Theoretical Prediction and Experimental Measurement of the Degree of Cure of Anisotropic Conductive Films (ACFs) for Chip-On-Flex (COF) Applications
Chung, Chang-Kyu, Kwon, Yong-Min, Kim, Il, Son, Ho-Young, Choo, Kyo-Sung, Kim, Sung-Jin, Paik, Kyung-Wook
Published in Journal of electronic materials (01.10.2008)
Published in Journal of electronic materials (01.10.2008)
Get full text
Journal Article
The effect of various wafer thicknesses on hot spot temperature
Kyo Sung Choo, Il Young Han, Sung Jin Kim
Published in 2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (01.05.2008)
Published in 2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (01.05.2008)
Get full text
Conference Proceeding
Theoretical prediction and experimental measurement of the degree-of-cure of anisotropic conductive film (ACF) for chip-on-flex (COF) applications
Chang-Kyu Chung, Yong-Min Kwon, Il Kim, Ho-Young Son, Kyo-Sung Choo, Sung-Jin Kim, Kyung-Wook Paik
Published in 2007 International Conference on Electronic Materials and Packaging (01.11.2007)
Published in 2007 International Conference on Electronic Materials and Packaging (01.11.2007)
Get full text
Conference Proceeding