by Yang, F., Chong, A.C.M., Lam, D.C.C., Tong, P.
Published in International journal of solids and structures (01.05.2002)

by Lam, D.C.C., Yang, F., Chong, A.C.M., Wang, J., Tong, P.
Published in Journal of the mechanics and physics of solids (01.08.2003)

by Chong, Arthur C. M., Lam, David C. C.
Published in Journal of materials research (01.10.1999)

by Chong, Alexander C M, Miller, Forrest, Buxton, McKee, Friis, Elizabeth A
Published in Journal of biomechanical engineering (01.08.2007)

by Chong, A. C. M., Yang, F., Lam, D. C. C., Tong, P.
Published in Journal of materials research (01.04.2001)

by Zhang, L, Jia, T-H, Chong, A C M, Bai, L, Yu, H, Gong, W, Wooley, P H, Yang, S-Y
Published in Gene therapy (01.10.2010)

by Lam, David C. C., Chong, Arthur C. M.
Published in Journal of materials research (01.09.1999)

by Lam, David C.C., Chong, Arthur C.M.
Published in Materials science & engineering. A, Structural materials : properties, microstructure and processing (01.11.2001)

by Lam, David C.C., Chong, Arthur C.M.
Published in Materials science & engineering. A, Structural materials : properties, microstructure and processing (15.04.2000)

by Lam, D. C. C., Chong, A. C. M.
Published in Journal of materials research (01.02.2001)

by Cheung, Y.M., Chong, A.C.M.
Published in Fifth International Conference onElectronic Packaging Technology Proceedings, 2003. ICEPT2003 (2003)

by Chong, A.C.M., Cheung, Y.M.
Published in Fifth International Conference onElectronic Packaging Technology Proceedings, 2003. ICEPT2003 (2003)