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Year of Publication 29.03.2022
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Year of Publication 15.03.2022
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Top via on subtractively etched conductive line
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Year of Publication 15.03.2022
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Published in Meeting abstracts (Electrochemical Society) (23.11.2020)
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Year of Publication 21.12.2023
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Year of Publication 21.12.2023
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Year of Publication 21.12.2023
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Year of Publication 30.11.2023
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Year of Publication 30.11.2023
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SELF-ALIGNED BACKSIDE CONTACT WITH INCREASED CONTACT AREA
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Year of Publication 30.11.2023
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Year of Publication 30.11.2023
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Subtractive Line with Damascene Second Line Type
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Year of Publication 03.02.2022
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Bottom Barrier Free Interconnects Without Voids
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Year of Publication 27.01.2022
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Year of Publication 27.01.2022
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Year of Publication 27.01.2022
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Year of Publication 27.01.2022
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Year of Publication 27.01.2022
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Year of Publication 27.01.2022
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Stepped top via for via resistance reduction
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Year of Publication 25.01.2022
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Year of Publication 25.01.2022
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TOP VIA WITH DAMASCENE LINE AND VIA
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Year of Publication 06.01.2022
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TOP VIA WITH NEXT LEVEL LINE SELECTIVE GROWTH
Clevenger, Lawrence A, Choi, Kisik, Penny, Christopher J, Lanzillo, Nicholas Anthony, ROBISON, Robert, Anderson, Brent
Year of Publication 06.01.2022
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Year of Publication 06.01.2022
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