Transient Anarthria in a Patient With Non-Dominant Hemispheric Lesion: A Case Report
Im, Yu Jin, Choi, Jihong, Kim, Yun-Hee, Chang, Won Hyuk
Published in Brain & NeuroRehabilitation (01.03.2022)
Published in Brain & NeuroRehabilitation (01.03.2022)
Get full text
Journal Article
10nm high performance mobile SoC design and technology co-developed for performance, power, and area scaling
Sam Yang, Yanxiang Liu, Ming Cai, Jerry Bao, Peijie Feng, Xiangdong Chen, Lixin Ge, Jun Yuan, Jihong Choi, Ping Liu, Youseok Suh, Hao Wang, Jie Deng, Yandong Gao, Yang, Jackie, Xiao-Yong Wang, Da Yang, Zhu, John, Penzes, Paul, Song, S. C., Park, Chulyong, Sungwon Kim, Jedon Kim, Sunggun Kang, Terzioglu, Esin, Ken Rim, Chidi Chidambaram, P. R.
Published in 2017 Symposium on VLSI Technology (01.06.2017)
Published in 2017 Symposium on VLSI Technology (01.06.2017)
Get full text
Conference Proceeding
집적 회로 다이의 상호연결 층 상의 층간 매체 내 딥 트렌치 커패시터들 및 관련 방법들
CHOI JIHONG, CHIDAMBARAM PERIANNAN, NALLAPATI GIRIDHAR, SONG STANLEY SEUNGCHUL
Year of Publication 19.01.2024
Get full text
Year of Publication 19.01.2024
Patent
Chip scale topography evolution model for CMP process optimization
Jihong Choi, Dornfeld, D.A.
Published in ISSM 2005, IEEE International Symposium on Semiconductor Manufacturing, 2005 (2005)
Published in ISSM 2005, IEEE International Symposium on Semiconductor Manufacturing, 2005 (2005)
Get full text
Conference Proceeding
집적 회로(IC) 칩을 패키지 기판에 인터페이싱하기 위한 커패시터 내장형 재배선 층(RDL) 기판을 채용하는 IC 패키지들 및 관련 방법들
CHOI JIHONG, KIM JONGHAE, STONE WILLIAM, CHIDAMBARAM PERIANNAN, SYED AHMER, NALLAPATI GIRIDHAR, XU JIANWEN
Year of Publication 02.01.2024
Get full text
Year of Publication 02.01.2024
Patent
Transient Anarthria in a Patient With Non-Dominant Hemispheric Lesion: A Case Report
Im, Yu Jin, Choi, Jihong, Kim, Yun-Hee, Chang, Won Hyuk
Published in Brain & NeuroRehabilitation (01.03.2022)
Get full text
Published in Brain & NeuroRehabilitation (01.03.2022)
Journal Article
5G and AI Integrated High Performance Mobile SoC Process-Design Co-Development and Production with 7nm EUV FinFET Technology
Deng, Jie, Roh, Ukjin, Bao, Jerry, Suh, Youseok, Choi, Jihong, Chen, Ying, Lin, Vicki, Cheng, Jason, Song, Zhimin, Cai, Ming, Ge, Lixin, Chen, Gary, Kim, Leo, Wang, Hao, Song, S. C., Sharma, Deepak, Wang, Xiao-Yong, Song, Byungmoo, Masuoka, Yuri Y., Lee, Kwon, Kim, Sungwon, Lee, Jinkyu, Jin, Hyejun, Boynapalli, Venu, Narayanan, Rajagopal, Penzes, Paul, Nallapati, Giri, Chidambaram, Chidi
Published in 2020 IEEE Symposium on VLSI Technology (01.06.2020)
Published in 2020 IEEE Symposium on VLSI Technology (01.06.2020)
Get full text
Conference Proceeding
7nm Mobile SoC and 5G Platform Technology and Design Co-Development for PPA and Manufacturability
Cai, Ming, Park, Hyunwoo, Yang, Jackie, Suh, Youseok, Chen, Jun, Gao, Yandong, Chang, Lunwei, Zhu, John, Song, S C, Choi, Jihong, Chen, Gary, Yu, Bo, Wang, Xiao-Yong, Huang, Vincent, Reddy, Gudoor, Kelageri, Nagaraj, Kidd, David, Penzes, Paul, Chung, Wayne, Yang, S.H., Lee, S.B., Tien, B.Z., Nallapati, Giri, Wu, S.-Y., Chidambaram, P. R.
Published in 2019 Symposium on VLSI Technology (01.06.2019)
Published in 2019 Symposium on VLSI Technology (01.06.2019)
Get full text
Conference Proceeding
High Performance Mobile SoC Productization with Second-Generation 10-nm FinFET Technology and Extension to 8-nm Scaling
Yuan, Jun, Rim, Ken, Chen, Ying, Cai, Ming, Suh, Youseok, Choi, Jihong, Deng, Jie, Bao, Jerry, Song, Zhimin, Ge, Lixin, Wang, Hao, Wang, Xiao-Yong, Lin, Vicki, Kuo, Chihwei, Yang, Sam, Rabindranath, Ashwin, Siva, Shrihari, Bhadri, Prasad, Kim, Sungwon, Lee, Kwon, Cho, Soon, Kang, Sunggun, Oh, Saechoon, Kwon, S. D., Chen, Xiangdong, Penzes, Paul, Agashe, Parag, Miller, William, Chidambaram, P. R.
Published in 2018 IEEE Symposium on VLSI Technology (01.06.2018)
Published in 2018 IEEE Symposium on VLSI Technology (01.06.2018)
Get full text
Conference Proceeding
INTEGRATED CIRCUIT (IC) PACKAGES EMPLOYING A CAPACITOR-EMBEDDED, REDISTRIBUTION LAYER (RDL) SUBSTRATE FOR INTERFACING AN IC CHIP(S) TO A PACKAGE SUBSTRATE, AND RELATED METHODS
SYED, Ahmer, NALLAPATI, Giridhar, STONE, William, KIM, Jonghae, XU, Jianwen, CHIDAMBARAM, Periannan, CHOI, Jihong
Year of Publication 28.02.2024
Get full text
Year of Publication 28.02.2024
Patent
System Design Technology Co-Optimization for 3D Integration at <5nm nodes
Song, S.C., Nallapati, Giri, Khan, Irfan, Nikfar, Nader, Yan, Bohan, Miranda, Miguel, Lim, Bruce, Nagarajan, Mali, Park, Joon-Young, Srinivas, Vaishnav, Langari, Reza, Chava, Bharani, Sanaka, Venu, Boynapalli, Venu, Gupta, Paras, Pandey, Shree, Xie, Biancun, Feng, Peijie, Choi, Jihong, Rakshit, Titash, Shenoy, Ravi, Nemani, Mahadev, Verrilli, Colin, Zhu, John, Chen, Jun, Nakamoto, Mark, Zhao, Lily, Sun, Yangyang, Atallah, Francois, Kim, Jonghae, Attar, Rashid, Chidambaram, Chidi
Published in 2021 IEEE International Electron Devices Meeting (IEDM) (11.12.2021)
Published in 2021 IEEE International Electron Devices Meeting (IEDM) (11.12.2021)
Get full text
Conference Proceeding
Evaluation of Barrier CMP Slurries and Characterization of ULK Material Properties Shifts Due to CMP
Tseng, Wei-Tsu, Kioussis, Dimitri, Manikonda, Shravanthi L., Kim, Hyun-Ki, Choi, Jihong, Zhao, Feng, Economikos, Laertis, Klymko, Nancy, Chace, Mark, Molis, Steve, Chae, Moosung, Engbrecht, Edward, Zielinski, Eden, Truong, Connie, Watts, David
Published in ECS transactions (09.05.2008)
Published in ECS transactions (09.05.2008)
Get full text
Journal Article