INTEGRATED CIRCUIT (IC) PACKAGES EMPLOYING A CAPACITOR-EMBEDDED, REDISTRIBUTION LAYER (RDL) SUBSTRATE FOR INTERFACING AN IC CHIP(S) TO A PACKAGE SUBSTRATE, AND RELATED METHODS
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Year of Publication 27.10.2022
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Year of Publication 27.10.2022
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Year of Publication 10.11.2020
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A Survey on Hospital Systems for Adverse Drug Event (ADE) History Information Sharing, Intervention, and Drug Safety Card Issue
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Published in Journal of Korean Society of Health-System Pharmacists (31.08.2022)
Published in Journal of Korean Society of Health-System Pharmacists (31.08.2022)
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CONTACT FOR SEMICONDUCTOR DEVICE
LIU, Yanxiang, SUH, Youseok, YANG, Haining, BAO, Junjing, CHOI, Jihong
Year of Publication 22.03.2018
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Year of Publication 22.03.2018
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Pacotes de circuito integrado (ic) que empregam um substrato de camada de redistribuição (rdl) embutido em capacitor para interfacear um chip(s) de ic para um substrato de pacote, e métodos relacionados
CHOI JIHONG, KIM JONGHAE, CHIDAMBARAM PERIANNAN, STONE WILLIAM, SYED AHMER, NALLAPATI GIRIDHAR, XU JIANWEN
Year of Publication 19.12.2023
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Year of Publication 19.12.2023
Patent
Integrated circuit (IC) packages employing a capacitor-embedded, redistribution layer (RDL) substrate for interfacing an IC chip(s) to a package substrate, and related methods
XU, JIANWEN, NALLAPATI, GIRIDHAR, SYED, AHMER, CHOI, JIHONG, CHIDAMBARAM, PERIANNAN, STONE, WILLIAM, KIM, JONGHAE
Year of Publication 01.12.2022
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Year of Publication 01.12.2022
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Systems and methods to reduce parasitic capacitance
Gu Shiqun, Chen Jun, Ramachandran Vidhya, Choi Jihong, Xu Jeffrey Junhao, Hau-Riege Christine Sung-An, Zhu John Jianhong, Yeap Choh Fei
Year of Publication 10.04.2018
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Year of Publication 10.04.2018
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