Telescope imaging beyond the Rayleigh limit in extremely low SNR
Choi, Hyunsoo, Choi, Seungman, Menart, Peter, Deka, Angshuman, Jacob, Zubin
Published in New journal of physics (01.09.2024)
Published in New journal of physics (01.09.2024)
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Journal Article
Dynamic ultraviolet harmonic beam pattern control by programmable spatial wavefront modulation of near-infrared fundamental beam
Won, Seungjai, Choi, Seungman, Kim, Taewon, Kim, Byunggi, Kim, Seung-Woo, Kim, Young-Jin
Published in Nanophotonics (Berlin, Germany) (04.08.2023)
Published in Nanophotonics (Berlin, Germany) (04.08.2023)
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Journal Article
Impact of electrode surface modulation on time-dependent dielectric breakdown
Kong Boon Yeap, Tian Shen, Zhang, Galor Wenyi, Sing Fui Yap, Holt, Brian, Gondal, Arfa, Seungman Choi, San Leong Liew, Yao, Walter, Justison, Patrick
Published in 2015 IEEE International Reliability Physics Symposium (01.04.2015)
Published in 2015 IEEE International Reliability Physics Symposium (01.04.2015)
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Conference Proceeding
Nickel Silicide Electromigration on Micro Ring Modulators for Silicon Photonics Technology
McGowan, Brian T., Rakowski, Michal, Choi, Seungman
Published in 2023 IEEE International Reliability Physics Symposium (IRPS) (01.03.2023)
Published in 2023 IEEE International Reliability Physics Symposium (IRPS) (01.03.2023)
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Conference Proceeding
Detailed Microstructure Characterizations of BEOL Cu Interconnects
Fu, Bianzhu, Gribelyuk, Michael A., Choi, Seungman
Published in Microscopy and microanalysis (01.08.2018)
Published in Microscopy and microanalysis (01.08.2018)
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Journal Article
APPARATUS ANS METHOD FOR EXTREME ULTRAVIOLET BEAM GENERATION
KIM BYUNGGI, CHOI SEUNGMAN, KIM YOUNG JIN, KIM SEUNG WOO, KIM YONG WOO, WON SEUNG JAI
Year of Publication 27.05.2024
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Year of Publication 27.05.2024
Patent
Compensation of laser propagation effects within solids for high harmonic generation of extreme ultraviolet radiation
Kim, Yong Woo, Kim, Byunggi, Choi, Seungman, Nam, Han Ku, Kim, Hyunwoong, Kim, Young-Jin, Kim, Seung-Woo
Published in Optics and laser technology (01.01.2022)
Published in Optics and laser technology (01.01.2022)
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Journal Article
Chip package interaction analysis for 20-nm technology with thermo-compression bonding with non-conductive paste
Jae Kyu Cho, Shan Gao, Seungman Choi, Smith, Ryan Scott, Eng Chye Chua, Kannan, Sukeshwar, Kuo, Bob, Jimarez, Miguel, JinSuk Jeong, YunHee Kim, JaeWook Shin, MyeongJin Kim, SeokHo Na
Published in 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) (01.05.2015)
Published in 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) (01.05.2015)
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Conference Proceeding
Robust BEOL MIMCAP for Long and Controllable TDDB Lifetime
Cheng, Lili, Choi, Seungman, Ogden, Sean, Tang, Teck Jung, Fox, Robert
Published in 2019 IEEE International Reliability Physics Symposium (IRPS) (01.03.2019)
Published in 2019 IEEE International Reliability Physics Symposium (IRPS) (01.03.2019)
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Conference Proceeding
Effect of metal line width on electromigration of BEOL Cu interconnects
Choi, Seungman, Christiansen, Cathryn, Cao, Linjun, Zhang, James, Filippi, Ronald, Shen, Tian, Yeap, Kong Boon, Ogden, Sean, Zhang, Haojun, Fu, Bianzhu, Justison, Patrick
Published in 2018 IEEE International Reliability Physics Symposium (IRPS) (01.03.2018)
Published in 2018 IEEE International Reliability Physics Symposium (IRPS) (01.03.2018)
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Conference Proceeding
Reliability challenges for 2.5D/3D integration: An overview
Premachandran, C S, Choi, Seungman, Cimino, Salvatore, Tran-Quinn, Thuy, Burrell, Lloyd, Justison, Patrick
Published in 2018 IEEE International Reliability Physics Symposium (IRPS) (01.03.2018)
Published in 2018 IEEE International Reliability Physics Symposium (IRPS) (01.03.2018)
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Conference Proceeding
Chip Packaging Interaction (CPI) with Cu Pillar Flip Chip for 20 nm Silicon Technology and Beyond
Gao, Shan, Smith, Ryan Scott, Cho, Jae Kyu, Choi, Seungman, Kannan, Sukeshwar, Chua, Engchye, Geisler, Holm, Kuechenmeister, Frank
Published in ECS journal of solid state science and technology (01.01.2015)
Published in ECS journal of solid state science and technology (01.01.2015)
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Journal Article