Formation of a nano-porous structured Cu layer by selective etching of a brass layer and sinter-bonding to achieve direct Cu–Cu bonding
Lee, Wan-Geun, Choi, Kwang-Seong, Eom, Yong-Sung, Lee, Jong-Hyun
Published in Journal of materials research and technology (01.01.2024)
Published in Journal of materials research and technology (01.01.2024)
Get full text
Journal Article
Process window of simultaneous transfer and bonding materials using laser‐assisted bonding for mini‐ and micro‐LED display panel packaging
Eom, Yong‐Sung, Choi, Gwang‐Mun, Jang, Ki‐Seok, Joo, Jiho, Lee, Chan‐mi, Oh, Jin‐Hyuk, Moon, Seok‐Hwan, Choi, Kwang‐Seong
Published in ETRI journal (01.04.2024)
Published in ETRI journal (01.04.2024)
Get full text
Journal Article
Collective laser‐assisted bonding process for 3D TSV integration with NCP
Alves Braganca, Wagno, Eom, Yong‐Sung, Jang, Keon‐Soo, Moon, Seok Hwan, Bae, Hyun‐Cheol, Choi, Kwang‐Seong
Published in ETRI journal (01.06.2019)
Published in ETRI journal (01.06.2019)
Get full text
Journal Article
Conductive adhesive with transient liquid‐phase sintering technology for high‐power device applications
Eom, Yong‐Sung, Jang, Keon‐Soo, Son, Ji‐Hye, Bae, Hyun‐Cheol, Choi, Kwang‐Seong
Published in ETRI journal (01.12.2019)
Published in ETRI journal (01.12.2019)
Get full text
Journal Article
Through Silicon Via (TSV) Defect Modeling, Measurement, and Analysis
Jung, Daniel H., Youngwoo Kim, Kim, Jonghoon J., Heegon Kim, Sumin Choi, Yoon-Ho Song, Hyun-Cheol Bae, Kwang-Seong Choi, Piersanti, Stefano, de Paulis, Francesco, Orlandi, Antonio, Joungho Kim
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.01.2017)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.01.2017)
Get full text
Journal Article
Characterization of a Hybrid Cu Paste as an Isotropic Conductive Adhesive
Eom, Yong‐Sung, Choi, Kwang‐Seong, Moon, Seok‐Hwan, Park, Jun‐Hee, Lee, Jong‐Hyun, Moon, Jong‐Tae
Published in ETRI journal (01.12.2011)
Published in ETRI journal (01.12.2011)
Get full text
Journal Article
Development and RF characteristics of analog 60-GHz electroabsorption modulator module for RF/optic conversion
Jeha Kim, Jeha Kim, Young-Shik Kang, Young-Shik Kang, Yong-Duck Chung, Yong-Duck Chung, Kwang-Seong Choi, Kwang-Seong Choi
Published in IEEE transactions on microwave theory and techniques (01.02.2006)
Published in IEEE transactions on microwave theory and techniques (01.02.2006)
Get full text
Journal Article
Sn58Bi Solder Interconnection for Low‐Temperature Flex‐on‐Flex Bonding
Lee, Haksun, Choi, Kwang‐Seong, Eom, Yong‐Sung, Bae, Hyun‐Cheol, Lee, Jin Ho
Published in ETRI journal (01.12.2016)
Published in ETRI journal (01.12.2016)
Get full text
Journal Article
A 60-GHz-Band Analog Optical System-on-Package Transmitter for Fiber-Radio Communications
Chung, Yong-Duck, Choi, Kwang-Seong, Sim, Jae-Sik, Yu, Hyun-Kyu, Kim, Jeha
Published in Journal of lightwave technology (01.11.2007)
Published in Journal of lightwave technology (01.11.2007)
Get full text
Journal Article
Fine‐Pitch Solder on Pad Process for Microbump Interconnection
Bae, Hyun‐Cheol, Lee, Haksun, Choi, Kwang‐Seong, Eom, Yong‐Sung
Published in ETRI journal (01.12.2013)
Published in ETRI journal (01.12.2013)
Get full text
Journal Article
Characterization of Fluxing and Hybrid Underfills with Micro‐encapsulated Catalyst for Long Pot Life
Eom, Yong‐Sung, Son, Ji‐Hye, Jang, Keon‐Soo, Lee, Hak‐Sun, Bae, Hyun‐Cheol, Choi, Kwang‐Seong, Choi, Heung‐Soap
Published in ETRI journal (01.06.2014)
Published in ETRI journal (01.06.2014)
Get full text
Journal Article
Novel Bumping Process for Solder on Pad Technology
Choi, Kwang‐Seong, Bae, Ho‐Eun, Bae, Hyun‐Cheol, Eom, Yong‐Sung
Published in ETRI journal (01.04.2013)
Published in ETRI journal (01.04.2013)
Get full text
Journal Article
Novel Bumping and Underfill Technologies for 3D IC Integration
Sung, Ki‐Jun, Choi, Kwang‐Seong, Bae, Hyun‐Cheol, Kwon, Yong‐Hwan, Eom, Yong‐Sung
Published in ETRI journal (01.10.2012)
Published in ETRI journal (01.10.2012)
Get full text
Journal Article