Microstructural evaluation and failure analysis of Ag wire bonded to Al pads
Choi, Mi-Ri, Kim, Hyung-Giun, Lee, Taeg-Woo, Jeon, Young-Jun, Ahn, Yong-Keun, Koo, Kyo-Wang, Jang, You-Cheol, Park, So-Yeon, Yee, Jae-Hak, Cho, Nam-Kwon, Kang, Il-Tae, Kim, Sangshik, Han, Seung-Zeon, Lim, Sung-Hwan
Published in Microelectronics and reliability (01.11.2015)
Published in Microelectronics and reliability (01.11.2015)
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Journal Article
Study of intermetallic compound growth and failure mechanisms in long term reliability of silver bonding wire
Jang, You Cheol, Park, So Yeon, Kim, Hyoung Dong, Ko, Yeo Chan, Koo, Kyo Wang, Choi, Mi Ri, Kim, Hyung Giun, Cho, Nam Kwon, Kang, Il Tae, Yee, Jae Hak, Lim, Sung Hwan
Published in 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) (01.12.2014)
Published in 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) (01.12.2014)
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Conference Proceeding