Co-Packaged Photonics For High Performance Computing: Status, Challenges And Opportunities
Mahajan, Ravi, Li, Xiaoqian, Fryman, Joshua, Zhang, Zhichao, Nekkanty, Srikant, Tadayon, Pooya, Jaussi, James, Shumarayev, Sergey, Agrawal, Ankur, Jadhav, Susheel, Singh, Kumar Abhishek, Alduino, Andrew, Gujjula, Sushrutha, Chiu, Chia-Pin, Nordstog, Thomas, Hosseini, Kaveh J., Sane, Sandeep, Deshpande, Nitin, Aygun, Kemal, Sarkar, Arnab, Dobriyal, Priyanka, Pothukuchi, Suresh, Pogue, Vanessa, Hui, David
Published in Journal of lightwave technology (15.01.2022)
Published in Journal of lightwave technology (15.01.2022)
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Journal Article
A simple approach for system level thermal transient prediction
Lin, Sheng-Chao, Tsai, Ruey, Chiu, Chia-Pin, Liu, Li-Kang
Published in Thermal science and engineering progress (01.03.2019)
Published in Thermal science and engineering progress (01.03.2019)
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Journal Article
Effect of Organic Binder Segregation on Sintered Strength of Dry-Pressed Alumina
Tanaka, Satoshi, Pin, Chiu Chia, Uematsu, Keizo
Published in Journal of the American Ceramic Society (01.06.2006)
Published in Journal of the American Ceramic Society (01.06.2006)
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Journal Article
Effect of internal binder on microstructure in compacts made from granules
Tanaka, Satoshi, Chia-Pin, Chiu, Kato, Zenji, Uematsu, Keizo
Published in Journal of the European Ceramic Society (2007)
Published in Journal of the European Ceramic Society (2007)
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Journal Article
Conference Proceeding
High-resolution ac-pulse modulated electrohydrodynamic jet printing on highly insulating substrates
Wei, Chuang, Qin, Hantang, Ramírez-Iglesias, Nakaira A, Chiu, Chia-Pin, Lee, Yuan-shin, Dong, Jingyan
Published in Journal of micromechanics and microengineering (01.04.2014)
Published in Journal of micromechanics and microengineering (01.04.2014)
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Journal Article
Silicon Photonics Chip I/O for Ultra High-Bandwidth and Energy-Efficient Die-to-Die Connectivity
Wang, Yuyang, Wang, Songli, Parsons, Robert, Novick, Asher, Gopal, Vignesh, Jang, Kaylx, Rizzo, Anthony, Chiu, Chia-Pin, Hosseini, Kaveh, Hoang, Tim Tri, Shumarayev, Sergey, Bergman, Keren
Published in 2024 IEEE Custom Integrated Circuits Conference (CICC) (21.04.2024)
Published in 2024 IEEE Custom Integrated Circuits Conference (CICC) (21.04.2024)
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Conference Proceeding
5.12 Tbps Co-Packaged FPGA and Silicon Photonics Interconnect I/O
Hosseini, Kaveh, Kok, Edwin, Shumarayev, Sergey Y., Jeong, Daniel, Chan, Allen, Katzin, Austin, Liu, Songtao, Roucka, Radek, Raval, Manan, Mac, Minh, Chiu, Chia-Pin, Tran, Thungoc, Singh, Kumar Abhishek, Raman, Sangeeta, Ke, Yanjing, Li, Chen, Yang, Li-Fan, Chao, Paulo, Lu, Haiwei, Luna, Fernando, Li, Xiaoqian, Hoang, Tim Tri, Sarkar, Arnab, Toda, Asako, Mahajan, Ravi, Deshpande, Nitin, O'Keeffe, Conor, Krishnamoorthy, Uma, Stojanovic, Vladimir, Madden, Chris, Zhang, Chong, Sysak, Matt, Bhargava, Pavan, Sun, Chen, Wade, Mark
Published in 2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits) (12.06.2022)
Published in 2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits) (12.06.2022)
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Conference Proceeding
Test chip and substrate design for flip chip microelectronic package thermal measurements
Joo Goh, Teck, Chiu, Chia-Pin, Seetharamu, K.N, Quadir, G.A, Zainal, Z.A
Published in Microelectronics international (01.05.2006)
Published in Microelectronics international (01.05.2006)
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Journal Article
Contact Pressure and Load Measurement Techniques for Applications in Semiconductor Packaging
Yagnamurthy, Sivakumar, Klein, Steven, Haehn, Nicholas, Reynolds, Seth, Harirchian, Tannaz, Chia-Pin Chiu, Devasenathipathy, Shankar, Malatkar, Pramod, Haowen Liu, Shaw Fong Wong
Published in 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) (01.05.2016)
Published in 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) (01.05.2016)
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Conference Proceeding
Density factor approach to representing impact of die power maps on thermal management
Torresola, J., Chia-Pin Chiu, Chrysler, G., Grannes, D., Mahajan, R., Prasher, R., Watwe, A.
Published in IEEE transactions on advanced packaging (01.11.2005)
Published in IEEE transactions on advanced packaging (01.11.2005)
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Journal Article
Thermal management of packages with 3D die stacking
Chia-Pin Chiu, Je-Young Chang, Saha, Sanjoy
Published in 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2012)
Published in 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2012)
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Conference Proceeding
8 Tbps Co-Packaged FPGA and Silicon Photonics Optical IO
Hosseini, Kaveh, Kok, Edwin, Shumarayev, Sergey Y., Chiu, Chia-Pin, Sarkar, Arnab, Toda, Asako, Ke, Yanjing, Chan, Allen, Jeong, Daniel, Zhang, Mason, Raman, Sangeeta, Tran, Thungoc, Singh, Kumar Abhishek, Bhargava, Pavan, Zhang, Chong, Lu, Haiwei, Mahajan, Ravi, Li, Xiaoqian, Deshpande, Nitin, O'Keeffe, Conor, Hoang, Tim Tri, Krishnamoorthy, Uma, Sun, Chen, Meade, Roy, Stojanovic, Vladimir, Wade, Mark
Published in 2021 Optical Fiber Communications Conference and Exhibition (OFC) (01.06.2021)
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Published in 2021 Optical Fiber Communications Conference and Exhibition (OFC) (01.06.2021)
Conference Proceeding