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Year of Publication 17.12.2009
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UV-curable solvent free compositions and use thereof in ceramic chip defect repair
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Year of Publication 12.02.2008
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Year of Publication 12.02.2008
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UV-curable solvent free compositions and use thereof in ceramic chip defect repair
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Year of Publication 12.02.2008
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CONDUCTIVE ADHESIVE REWORK METHOD
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Year of Publication 24.01.2008
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Year of Publication 24.01.2008
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CONDUCTIVE ADHESIVE COMPOSITION
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Year of Publication 22.11.2007
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Year of Publication 22.11.2007
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UV-curable solvent free compositions and use thereof in ceramic chip defect repair
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Year of Publication 30.03.2006
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Temporary chip attach method using reworkable conductive adhesive interconnections
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Year of Publication 19.01.2006
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Year of Publication 19.01.2006
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THERMAL INTERFACE ADHESIVE AND REPROCESSING
DAVES GLENN G, TOY HILTON T, SACHDEV KRISHNA G, BERGER DANIEL G, CHIOUJONES KELLY M
Year of Publication 24.11.2005
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Year of Publication 24.11.2005
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THERMAL INTERFACE ADHESIVE AND REWORK
DAVES GLENN G, TOY HILTON T, SACHDEV KRISHNA G, BERGER DANIEL G, CHIOUJONES KELLY M
Year of Publication 17.11.2005
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Year of Publication 17.11.2005
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Interface adhesive compsn. and rework prepn
SACHDEV KRISHNA G.,BERGER DANIEL G.,CHIOUJONES KELLY M.,DAVES GLENN G.,TOY HILTON T
Year of Publication 16.11.2005
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Year of Publication 16.11.2005
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Thermal interface adhesive and rework
BERGER, DANIEL G, DAVES, GLENN G, TOY, HILTON T, SACHDEV, KRISHNA G, CHIOUJONES, KELLY M
Year of Publication 01.01.2012
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Year of Publication 01.01.2012
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Reprocessing conductive adhesive composition and its preparation method
DAVES GLENN G, TOY HILTON T, SACHDEV KRISHNA G, BERGER DANIEL G, CHIOUJONES KELLY M
Year of Publication 26.05.2010
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Year of Publication 26.05.2010
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Thermal interface adhesive and rework
BERGER, DANIEL G, DAVES, GLENN G, TOY, HILTON T, SACHDEV, KRISHNA G, CHIOUJONES, KELLY M
Year of Publication 16.02.2006
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Year of Publication 16.02.2006
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