White Light-Emitting Diodes With High Color Rendering Index and Tunable Color Temperature Fabricated Using Separated Phosphor Layer Structure
Chiang, Chung-Hao, Gong, Syuan-Jhih, Zhan, Ting-Shi, Cheng, Kuo-Ching, Chu, Sheng-Yuan
Published in IEEE electron device letters (01.07.2016)
Published in IEEE electron device letters (01.07.2016)
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Journal Article
Preparation of CuS/PbS/ZnO Heterojunction Photocatalyst for Application in Hydrogen Production
Chiu, Ming-Huan, Kuo, Cheng-Ching, Huang, Chao-Wei, Yang, Wein-Duo
Published in Catalysts (01.12.2022)
Published in Catalysts (01.12.2022)
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Journal Article
Lightweight mediated quantum key distribution
Hwang, Tzonelih, Chen, Yen-Jie, Tsai, Chia-Wei, Kuo, Cheng-Ching, Chen, Ming-Jun
Published in Optik (Stuttgart) (01.09.2023)
Published in Optik (Stuttgart) (01.09.2023)
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Journal Article
Simulation modeling of 600mm X600mm fan-out panel level for warpage behavior based on chip first
Cheng, Kuo-Ching, Chen, Bo-Heng, Chen, Cong-Wei, Chan, Ya-Fang, Wang, Burnet, Yang, Jeffrey, Fang, Jen-Kuang
Published in 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) (05.12.2023)
Published in 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) (05.12.2023)
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Conference Proceeding
Simulation Modeling of 600mm X600mm Fan-Out Panel Level for Warpage Behavior Based on Chip First
Cheng, Kuo-Ching, Chen, Bo-Heng, Chen, Cong-Wei, Chan, Ya-Fang, Wang, Burnet, Yang, Jeffrey, Fang, Jen-Kuang
Published in 2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (25.10.2023)
Published in 2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (25.10.2023)
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Conference Proceeding