Search Results - "CHING, JR. MARIANO LAYSON" :: K.UTB vyhledávací portál

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Lead-frame assembly, semiconductor package and methods for improved adhesion

by Descartin, Allen Marfil, Ching, Jr., Mariano Layson, Li, Jun
Year of Publication 05.03.2024

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LEAD-FRAME ASSEMBLY, SEMICONDUCTOR PACKAGE AND METHODS FOR IMPROVED ADHESION

by Descartin, Allen Marfil, Li, Jun, Ching Jr., Mariano Layson
Year of Publication 28.12.2022

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Cavity formed in a molding compound of a semiconductor package to reduce mechanical stress on a portion of a die in the package, and methods of formation

by Ge, You, Wang, Zhijie, Lee, Yit Meng, Ching, Jr., Mariano Layson
Year of Publication 14.05.2024

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CAVITY FORMED IN A MOLDING COMPOUND OF A SEMICONDUCTOR PACKAGE TO REDUCE MECHANICAL STRESS ON A PORTION OF A DIE IN THE PACKAGE, AND METHODS OF FORMATION

by Ge, You, Wang, Zhijie, Lee, Yit Meng, Ching Jr., Mariano Layson
Year of Publication 19.04.2023

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Pressure-sensing integrated circuit device with diaphragm

by Arayata, Alexander M, Ching, Jr., Mariano Layson, Descartin, Allen M
Year of Publication 11.12.2018

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Lead reduction for improved creepage distance

by Descartin, Allen Marfil, Carpenter, Burton Jesse, Ching, Jr., Mariano Layson, Lee, Yit Meng, Liu, Jinmei
Year of Publication 04.08.2020

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Hybrid lead frame for semiconductor die package with improved creepage distance

by Zhang, Lidong, Phillips, Kendall Dewayne, Carpenter, Burton Jesse, Chen, Quan, Ching, Jr., Mariano Layson, Lye, Meng Kong
Year of Publication 04.08.2020

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Cavities formed in semiconductor package molding compound and methods of forming

by MARIANO LAYSON CHING JR, GE YOU, LI YIMING, WANG ZHIJIE
Year of Publication 18.04.2023

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Lead frame assembly, semiconductor package and method for improving bonding

by MARIANO LAYSON CHING JR, LI JUN, DESCARTIN, AARON, MATTHEW
Year of Publication 27.12.2022

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Packaged integrated circuit having stacked die and method for therefor

by Higgins, III, Leo M, Pang, Xingshou, Carpenter, Burton Jesse, Brauchler, Fred T, Wang, Jianhong, Ching, Jr., Mariano Layson, Liu, Jinmei, Yao, Jinzhong, Wei, Yadong
Year of Publication 15.10.2019

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Lead frame with selective pattern plating

by MARIANO LAYSON CHING JR, LI JUN, ZHANG LIDON, ALLEN MARFIL DESCARTIN, SONG MEIJIANG
Year of Publication 26.06.2020

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Lead shortening to improve creepage distance

by BURTON JESE CARPENTER, LEE YIT-MENG, MARIANO LAYSON CHING JR, LIU JINMEI, ALLEN MARFIL DESCARTIN
Year of Publication 26.06.2020

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Pressure sensing integrated circuit device with diaphragm

by MARIANO LAYSON CHING, JR, ALEXANDER M. ARAYATA, ALLEN M. DESCARTIN
Year of Publication 24.10.2017

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CAVITY FORMED IN A MOLDING COMPOUND OF A SEMICONDUCTOR PACKAGE TO REDUCE MECHANICAL STRESS ON A PORTION OF A DIE IN THE PACKAGE, AND METHODS OF FORMATION

by Ge, You, Wang, Zhijie, Lee, Yit Meng, Ching, JR., Mariano Layson
Year of Publication 20.04.2023

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LEAD-FRAME ASSEMBLY, SEMICONDUCTOR PACKAGE AND METHODS FOR IMPROVED ADHESION

by Descartin, Allen Marfil, Ching, JR., Mariano Layson, Li, Jun
Year of Publication 29.12.2022

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Packaged integrated circuit with stacked tube cores and method thereof

by JINZHONG YAO, MARIANO LAYSON CHING JR, FRED T. BRAUCHLER, JIANHONG WANG, JINMEI LIU, LEO M. HIGGINS, III, YADONG WEI, BURTON JESSE CARPENTER, XINGSHOU PANG
Year of Publication 26.03.2019

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LEAD FRAME WITH SELECTIVE PATTERNED PLATING

by Descartin, Allen Marfil, Zhang, Lidong, Ching, JR., Mariano Layson, Song, Meijiang, Li, Jun
Year of Publication 25.06.2020

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HYBRID LEAD FRAME FOR SEMICONDUCTOR DIE PACKAGE WITH IMPROVED CREEPAGE DISTANCE

by CHEN, Quan, CARPENTER, Burton Jesse, PHILLIPS, Kendall Dewayne, CHING, JR., Mariano Layson, LYE, Meng Kong, ZHANG, Lidong
Year of Publication 25.06.2020

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