Comprehensive Technology Function Product Matrix for Intelligent Chatbot Patent Mining
Oscar Hong, N.J., Govindarajan, Usharani Hareesh, Jack Chang Chien, Y.C., Amy Trappey, J.C.
Published in 2019 IEEE International Conference on Systems, Man and Cybernetics (SMC) (01.10.2019)
Published in 2019 IEEE International Conference on Systems, Man and Cybernetics (SMC) (01.10.2019)
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Conference Proceeding
FAST MONTE CARLO SIMULATION METHODS FOR BIOLOGICAL REACTION-DIFFUSION SYSTEMS IN SOLUTION AND ON SURFACES
Kerr, Rex A, Bartol, Thomas M, Kaminsky, Boris, Dittrich, Markus, Chang, Jen-Chien Jack, Baden, Scott B, Sejnowski, Terrence J, Stiles, Joel R
Published in SIAM journal on scientific computing (13.10.2008)
Published in SIAM journal on scientific computing (13.10.2008)
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Journal Article
SEMICONDUCTOR DIE HAVING A REDISTRIBUTION LAYER
CHIU CHIN TIEN, LIAO CHIEN KO, TAKIAR HEM, YU CHEEMEN, CHIEN JACK CHANG
Year of Publication 01.04.2010
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Year of Publication 01.04.2010
Patent
FAST MONTE CARLO SIMULATION METHODS FOR BIOLOGICAL REACTION-DIFFUSION SYSTEMS IN SOLUTION AND ON SURFACES: Computational Science and Engineering
KERR, Rex A, BARTOL, Thomas M, KAMINSKY, Boris, DITTRICH, Markus, CHANG, Jen-Chien Jack, BADEN, Scott B, SEJNOWSKI, Terrence J, STILES, Joel R
Published in SIAM journal on scientific computing (2009)
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Published in SIAM journal on scientific computing (2009)
Journal Article
Semiconductor die having a redistribution layer
Liao, Chien-Ko, Chiu, Chin-Tien, Chien, Jack Chang, Yu, Cheemen, Takiar, Hem
Year of Publication 03.07.2012
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Year of Publication 03.07.2012
Patent
SEMICONDUCTOR DIE HAVING A REDISTRIBUTION LAYER
YU, CHEEMEN, TAKIAR, HEM, CHIEN, JACK, CHANG, CHIU, CHIN-TIEN, LIAO, CHIEN-KO
Year of Publication 07.08.2013
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Year of Publication 07.08.2013
Patent
System for separating a diced semiconductor die from a die attach tape
LIANG XINGZHI, WANG LI, CHIEN JACK CHANG, ONG KING HOO, MA SHICAI, WANG WEILI
Year of Publication 06.08.2013
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Year of Publication 06.08.2013
Patent
Semiconductor package having through holes for molding back side of package
Chiu, Chin-Tien, Takiar, Hem, Liao, Chih-Chin, Yu, Cheemen, Ye, Ning, Chien, Jack Chang
Year of Publication 31.05.2011
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Year of Publication 31.05.2011
Patent
Method of fabricating a semiconductor package having through holes for molding back side of package
Chiu, Chin-Tien, Takiar, Hem, Liao, Chih-Chin, Yu, Cheemen, Ye, Ning, Chien, Jack Chang
Year of Publication 10.05.2011
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Year of Publication 10.05.2011
Patent
Semiconductor die having a redistribution layer
Liao, Chien-Ko, Chiu, Chin-Tien, Chien, Jack Chang, Yu, Cheeman, Takiar, Hem
Year of Publication 10.05.2011
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Year of Publication 10.05.2011
Patent
Semiconductor die having a redistribution layer
CHIU CHIN-TIEN, TAKIAR HEM, YU CHEEMEN, CHIEN JACK CHANG, LIAO CHIEN-KO
Year of Publication 03.07.2012
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Year of Publication 03.07.2012
Patent
SYSTEM FOR SEPARATING A DICED SEMICONDUCTOR DIE FROM A DIE ATTACH TAPE
LIANG XINGZHI, WANG LI, CHIEN JACK CHANG, MA SHICAI, ONG KH, WANG WEILI
Year of Publication 14.06.2012
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Year of Publication 14.06.2012
Patent
Method of fabricating a semiconductor die having a redistribution layer
Liao, Chien-Ko, Chiu, Chin-Tien, Chien, Jack Chang, Yu, Cheemen, Takiar, Hem
Year of Publication 10.08.2010
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Year of Publication 10.08.2010
Patent
Semiconductor die having a distribution layer
Liao, Chien-Ko, Chiu, Chin-Tien, Chien, Jack Chang, Yu, Cheemen, Takiar, Hem
Year of Publication 27.07.2010
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Year of Publication 27.07.2010
Patent
SEMICONDUCTOR DIE HAVING A REDISTRIBUTION LAYER
CHIU CHIN-TIEN, TAKIAR HEM, YU CHEEMEN, CHIEN JACK CHANG, LIAO CHIEN-KO
Year of Publication 01.09.2011
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Year of Publication 01.09.2011
Patent