Mechanical couplings designed to resolve process constraints
Chien, Yuh-Harng, Lee, Fu-Kang, Chou, Hung-Yu, Kummerl, Steven Alfred
Year of Publication 16.07.2024
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Year of Publication 16.07.2024
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Semiconductor die mounted in a recess of die pad
Peng, Dong-Ren, Chien, Yuh-Harng, Chou, Hung-Yu, Lin, Chung-Hao, Huang, Pi-Chiang, Pan, Bo-Hsun
Year of Publication 02.01.2024
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Year of Publication 02.01.2024
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LEAD FINGER WITH Z-DIRECTION OBSTRUCTION FEATURE
Tu, Che Wei, Chien, Yuh-Harng, Chou, Hung-Yu, Chang, Megan, Ho, Chih-Chien, Hsiao, Hsiang Ming, Pan, Bo-Hsun
Year of Publication 05.10.2023
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Year of Publication 05.10.2023
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Exposed heat-generating devices
Chien, Yuh-Harng, Chou, Hung-Yu, Kummerl, Steven Alfred, Yu, Fu-Hua, Chien, Chi-Chen, Pan, Bo-Hsun
Year of Publication 29.08.2023
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Year of Publication 29.08.2023
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Packages with multiple exposed pads
Chien, Yuh-Harng, Chou, Hung-Yu, Yu, Fu-Hua, Kummerl, Steven Alfred, Murugan, Rajen M, Chen, Jie, Pan, Bo-Hsun
Year of Publication 22.08.2023
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Year of Publication 22.08.2023
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DIE PAD RECESSES
CHIEN, Yuh-Harng, LIN, Chung-Hao, PAN, Bo-Hsun, PENG, Dong-Ren, HUANG, Pi-Chiang, CHOU, Hung-Yu
Year of Publication 02.03.2023
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Year of Publication 02.03.2023
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PACKAGES WITH MULTIPLE EXPOSED PADS
CHIEN, Yuh-Harng, CHEN, Jie, YU, Fu-Hua, MURUGAN, Rajen M, PAN, Bo-Hsun, KUMMERL, Steven Alfred, CHOU, Hung-Yu
Year of Publication 07.12.2023
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Year of Publication 07.12.2023
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