High-performance electrodeposited copper wicks for heat-spreading vapor chambers
Yu, Jui-Cheng, Chien, Heng-Chieh, Chiang, Chao-Yang, Liu, En-Chia, Chang, Yu-Hsiang, Huang, Hung-Hsien, Chen, Tang-Yuan, Kao, Chin-Li, Liao, Chien-Neng
Published in Applied thermal engineering (25.06.2023)
Published in Applied thermal engineering (25.06.2023)
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Journal Article
Through-Silicon Hole Interposers for 3-D IC Integration
Lau, John H., Lee, Ching-Kuan, Zhan, Chau-Jie, Wu, Sheng-Tsai, Chao, Yu-Lin, Dai, Ming-Ji, Tain, Ra-Min, Chien, Heng-Chieh, Hung, Jui-Feng, Chien, Chun-Hsien, Cheng, Ren-Shing, Huang, Yu-Wei, Cheng, Yu-Mei, Liao, Li-Ling, Lo, Wei-Chung, Kao, Ming-Jer
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.09.2014)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.09.2014)
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Journal Article
Thermal conductivity of thermoelectric thick films prepared by electrodeposition
Chien, Heng-Chieh, Yang, Chii-Rong, Liao, Li-Ling, Liu, Chun-Kai, Dai, Ming-Ji, Tain, Ra-Min, Yao, Da-Jeng
Published in Applied thermal engineering (01.03.2013)
Published in Applied thermal engineering (01.03.2013)
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Journal Article
A novel method to rapidly determine the key properties of thermoelectric devices
En-Ting Chu, Heng-Chieh Chien, Huey-Lin Hsieh, Jing-Yi Huang, Chun-Kai Liu, Da-Jeng Yao
Published in 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (01.05.2012)
Published in 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (01.05.2012)
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Conference Proceeding
Evaluation of Temperature-Dependent Effective Material Properties and Performance of a Thermoelectric Module
Chien, Heng-Chieh, Chu, En-Ting, Hsieh, Huey-Lin, Huang, Jing-Yi, Wu, Sheng-Tsai, Dai, Ming-Ji, Liu, Chun-Kai, Yao, Da-Jeng
Published in Journal of electronic materials (01.07.2013)
Published in Journal of electronic materials (01.07.2013)
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Journal Article
Conference Proceeding
Thermal evaluation and analyses of 3D IC integration SiP with TSVs for network system applications
Heng-Chieh Chien, Lau, J. H., Yu-Lin Chao, Ming-Ji Dai, Ra-Min Tain, Li, L., Su, P., Xue, J., Brillhart, M.
Published in 2012 IEEE 62nd Electronic Components and Technology Conference (01.05.2012)
Published in 2012 IEEE 62nd Electronic Components and Technology Conference (01.05.2012)
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Conference Proceeding
Interplay and influence of thermomechanical stress in copper-filled TSV interposers
Sheng-Tsai Wu, Cheng-fu Chen, Heng-Chieh Chien
Published in 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) (01.05.2014)
Published in 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) (01.05.2014)
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Conference Proceeding
Thermal and mechanical design and analysis of 3D IC interposer with double-sided active chips
Sheng-Tsai Wu, Heng-Chieh Chien, Lau, John H., Ming Li, Cline, Julia, Ji, Mandy
Published in 2013 IEEE 63rd Electronic Components and Technology Conference (01.05.2013)
Published in 2013 IEEE 63rd Electronic Components and Technology Conference (01.05.2013)
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Conference Proceeding
Low-cost TSH (through-silicon hole) interposers for 3D IC integration
Lau, John H., Ching-Kuan Lee, Chau-Jie Zhan, Sheng-Tsai Wu, Yu-Lin Chao, Ming-Ji Dai, Ra-Min Tain, Heng-Chieh Chien, Chun-Hsien Chien, Ren-Shin Cheng, Yu-Wei Huang, Yuan-Chang Lee, Zhi-Cheng Hsiao, Wen-Li Tsai, Pai-Cheng Chang, Huan-Chun Fu, Yu-Mei Cheng, Li-Ling Liao, Wei-Chung Lo, Ming-Jer Kao
Published in 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) (01.05.2014)
Published in 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) (01.05.2014)
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Conference Proceeding
Assembly process and reliability assessment of TSV/RDL/IPD interposer with multi-chip-stacking for 3D IC integration SiP
Chau-Jie Zhan, Pei-Jer Tzeng, Lau, J. H., Ming-Ji Dai, Heng-Chieh Chien, Ching-Kuan Lee, Shang-Tsai Wu, Kuo-Shu Kao, Shin-Yi Huang, Chia-Wen Fan, Su-Ching Chung, Yu-Wei Huang, Yu-Min Lin, Jing-Yao Chang, Tsung-Fu Yang, Tai-Hung Chen, Lo, R., Kao, M. J.
Published in 2012 IEEE 62nd Electronic Components and Technology Conference (01.05.2012)
Published in 2012 IEEE 62nd Electronic Components and Technology Conference (01.05.2012)
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Conference Proceeding
Analytical description of the out-of-plane equivalent mechanical properties of through-silicon via interposers
Cheng-fu Chen, Sheng-Tsai Wu, Ming-Ji Dai, Heng-Chieh Chien, Chang-Sheng Chen, Wei-Chung Lo
Published in 2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2013)
Published in 2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2013)
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Conference Proceeding
Ultra low-cost through-silicon holes (TSHs) interposers for 3D IC integration SiPs
Sheng-Tsai Wu, Lau, J. H., Heng-Chieh Chien, Jui-Feng Hung, Ming-Ji Dai, Yu-Lin Chao, Ra-Min Tain, Wei-Chung Lo, Ming-Jer Kao
Published in 2012 IEEE 62nd Electronic Components and Technology Conference (01.05.2012)
Published in 2012 IEEE 62nd Electronic Components and Technology Conference (01.05.2012)
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Conference Proceeding
A thermal performance measurement method for blind through silicon vias (TSVs) in a 300mm wafer
Heng-Chieh Chien, Yu-Lin Chao, Lau, J. H., Ra-Min Tain, Ming-Ji Dai, Pei-Jer Tzeng, Cha-Hsin Lin, Yu-Chen Hsin, Shang-Chun Chen, Jui-Chin Chen, Chien-Chou Chen, Chi-Hon Ho, Wei-Chung Lo, Tzu-Kun Ku, Ming-Jer Kao
Published in 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) (01.05.2011)
Published in 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) (01.05.2011)
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Conference Proceeding