Thermal Performance Assessment and Validation of High-Concentration Photovoltaic Solar Cell Module
CHOU, Tsung-Lin, SHIH, Zun-Hao, HONG, Hwen-Fen, HAN, Cheng-Nan, CHIANG, Kou-Ning
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.04.2012)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.04.2012)
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Journal Article
Measurement and simulation of interfacial adhesion strength between SiO2 thin film and III–V material
Chou, Tsung-Lin, Yang, Shin-Yueh, Wu, Chung-Jung, Han, Cheng-Nan, Chiang, Kou-Ning
Published in Microelectronics and reliability (01.09.2011)
Published in Microelectronics and reliability (01.09.2011)
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Journal Article
Conference Proceeding
Application of Artificial and recurrent neural network on the steady-state and transient finite element modeling
Yuan, Cadmus, Hong, Yu-Jun, Lee, Chang-Chi, Chiang, Kou-Ning, Huang, Jin-Huang
Published in 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (01.03.2019)
Published in 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (01.03.2019)
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Conference Proceeding
Investigation of the thermal performance of high-concentration photovoltaic solar cell package
Tsung-Lin Chou, Zun-Hao Shih, Hwen-Fen Hong, Cheng-Nan Han, Kou-Ning Chiang
Published in 2007 International Conference on Electronic Materials and Packaging (01.11.2007)
Published in 2007 International Conference on Electronic Materials and Packaging (01.11.2007)
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Conference Proceeding
A Study of Failure Mechanism and Reliability Assessment for the Panel Level Package (PLP) Technology
Ming-Chih Yew, Hsiu-Ping Wei, Ching-Shun Huang, Dyi-Chung Hu, Wen-Kung Yang, Kou-Ning Chiang
Published in 2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007 (01.04.2007)
Published in 2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007 (01.04.2007)
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Conference Proceeding
Design, analysis, and development of novel three-dimensional stacking WLCSP
Yuan, C.-A., Cheng Nan Han, Ming-Chih Yew, Chan-Yen Chou, Kou-Ning Chiang
Published in IEEE transactions on advanced packaging (01.08.2005)
Published in IEEE transactions on advanced packaging (01.08.2005)
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Journal Article
Thermal performance and solder joint reliability for board level assembly of modified leadframe package
Chien Chen Lee, Chang Chun Lee, Kou Ning Chiang
Published in EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005 (2005)
Published in EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005 (2005)
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Conference Proceeding
Design and Analysis of a novel fan-out WLCSP structure
Cadmus Yuan, Zhang, G.Q., Ching-Shun Huang, Chun-Hui Yu, Chin-Cheng Yang, Wen-Kung Yang, Ming-Chih Yew, Chou, C.Y., Kou-Ning Chiang
Published in EuroSime 2006 - 7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems (2006)
Published in EuroSime 2006 - 7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems (2006)
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Conference Proceeding
Design and analysis of novel glass WLCSP structure
Chang-Ann Yuan, Cheng Nan Han, Kou-Ning Chiang
Published in 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, 2004. EuroSimE 2004. Proceedings of the (2004)
Published in 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, 2004. EuroSimE 2004. Proceedings of the (2004)
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Conference Proceeding
Design, Experiment and Analysis of the Solder on Rubber (SOR) structure of WLCSP
Yuan, C., Zhang, G.Q., Ching-Shun Huang, Chun-Hui Yu, Chin-Cheng Yang, Wen-Kung Yang, Ming-Chih Yew, Cheng Nan Han, Kou-Ning Chiang
Published in EuroSime 2006 - 7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems (2006)
Published in EuroSime 2006 - 7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems (2006)
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Conference Proceeding