ELECTRONIC ASSEMBLY HAVING A COOLING FEATURE AND METHODS OF FORMING THEREOF
CHEAH, Bok Eng, ONG, Jenny Shio Yin, KONG, Jackson Chung Peng, LIM, Seok Ling, OOI, Kooi Chi
Year of Publication 29.02.2024
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Year of Publication 29.02.2024
Patent
VERTICAL INTERCONNECT DESIGN FOR IMPROVED ELECTRICAL PERFORMANCE
CHEAH, Bok Eng, CHEW, Li Wern, TEH, Kok Hou, KONG, Jackson Chung Peng, OOI, Kooi Chi
Year of Publication 13.04.2023
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Year of Publication 13.04.2023
Patent
INTEGRATED BRIDGE FOR DIE-TO-DIE INTERCONNECTS
CHEAH, Bok Eng, OOI, KOOI CHI, ONG, JENNY SHIO YIN, KONG, Jackson Chung Peng, LIM, SEOK LING
Year of Publication 30.01.2024
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Year of Publication 30.01.2024
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Evaluating risk factors of proposed vehicle maneuvers using external and internal data
Conde, Naissa, Ooi, Kooi Chi, Qawami, Shekoufeh, Baron, Casey, Yu, Mengjie
Year of Publication 21.02.2023
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Year of Publication 21.02.2023
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Methods and apparatus for allocating a workload to an accelerator using machine learning
Ooi, Kooi Chi, Vijayaraghavan, Divya, Lim, Min Suet, Larsen, Denica, Pinilla Pico, Lady Nataly
Year of Publication 21.02.2023
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Year of Publication 21.02.2023
Patent
SEMICONDUCTOR PACKAGES FOR ALTERNATE STACKED MEMORY AND METHODS OF MANUFACTURING THE SAME
CHEAH, Bok Eng, ONG, Jenny Shio Yin, KONG, Jackson Chung Peng, LIM, Seok Ling, OOI, Kooi Chi
Year of Publication 04.01.2024
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Year of Publication 04.01.2024
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SEMICONDUCTOR PACKAGE WITH EXTENDED STIFFENER
CHEAH, Bok Eng, ONG, Jenny Shio Yin, KONG, Jackson Chung Peng, LIM, Seok Ling, OOI, Kooi Chi
Year of Publication 04.01.2024
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Year of Publication 04.01.2024
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METHODS OF FORMING INTER-STACK DICE BRIDGE STRUCTURES
YONG, Khang Choong, CHEAH, Bok Eng, KONG, Jackson Chung Peng, OOI, Kooi Chi
Year of Publication 05.01.2023
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Year of Publication 05.01.2023
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Semiconductor device and system
Yap, Lee Fueng, Cheah, Bok Eng, Kong, Jackson Chung Peng, Ooi, Kooi Chi, Lee, Chan Kim
Year of Publication 25.10.2022
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Year of Publication 25.10.2022
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INTERCONNECT CORE
CHEAH, Bok Eng, OOI, Ping Ping, KONG. Jackson Chung Peng, OOI, Kooi Chi
Year of Publication 26.07.2022
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Year of Publication 26.07.2022
Patent
HYBRID SEMICONDUCTOR PACKAGE FOR IMPROVED POWER INTEGRITY
CHEAH, Bok Eng, ONG, Jenny Shio Yin, KONG, Jackson Chung Peng, LIM, Seok Ling, OOI, Kooi Chi
Year of Publication 15.06.2023
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Year of Publication 15.06.2023
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STACKED DICE SYSTEMS
CHEAH, Bok Eng, OOI, Ping Ping, KONG, Jackson Chung Peng, OOI, Kooi Chi
Year of Publication 25.07.2022
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Year of Publication 25.07.2022
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Embedded reference layers for semiconductor package substrates
Cheah, Bok Eng, Kong, Jackson Chung Peng, Ooi, Kooi Chi, Lim, Seok Ling, Ong, Jenny Shio Yin
Year of Publication 13.06.2023
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Year of Publication 13.06.2023
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MULTI-CONDUCTOR INTERCONNECT STRUCTURE FOR A MICROELECTRONIC DEVICE
CHEAH, Bok Eng, OOI, Ping Ping, KONG, Jackson Chung Peng, OOI, Kooi Chi
Year of Publication 30.06.2022
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Year of Publication 30.06.2022
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SUBSTRATE WITH GRADIATED DIELECTRIC FOR REDUCING IMPEDANCE MISMATCH
CHEAH, Bok Eng, OOI, Ping Ping, KONG, Jackson Chung Peng, OOI, Kooi Chi
Year of Publication 16.06.2022
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Year of Publication 16.06.2022
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Interconnect core
Kong, Jackson Chung Peng, Cheah, Bok Eng, Ooi, Kooi Chi, Ooi, Ping Ping
Year of Publication 07.06.2022
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Year of Publication 07.06.2022
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FOLDABLE COMPRESSION ATTACHED MEMORY MODULE (FCAMM)
CHEAH, Bok Eng, ONG, Jenny Shio Yin, KONG, Jackson Chung Peng, LIM, Seok Ling, OOI, Kooi Chi
Year of Publication 20.04.2023
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Year of Publication 20.04.2023
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INTERCONNECTS BRIDGES FOR MULTI-CHIP PACKAGES
CHEAH, Bok Eng, ONG, Jenny Shio Yin, KONG, Jackson Chung Peng, LIM, Seok Ling, OOI, Kooi Chi
Year of Publication 02.03.2023
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Year of Publication 02.03.2023
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SUBSTRATE WITH GRADIATED DIELECTRIC FOR REDUCING IMPEDANCE MISMATCH
Kong, Jackson Chung Peng, Cheah, Bok Eng, Ooi, Kooi Chi, Ooi, Ping Ping
Year of Publication 31.03.2022
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Year of Publication 31.03.2022
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