High Power Module Package Mounting and Temperature Cycling Reliability Study by Simulation
Qian, Richard, Yao, Alex, Xu, Bruce, Liu, Yong, Chew, CH
Published in 2018 19th International Conference on Electronic Packaging Technology (ICEPT) (01.08.2018)
Published in 2018 19th International Conference on Electronic Packaging Technology (ICEPT) (01.08.2018)
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Conference Proceeding
Ultrafine Barium Titanate Powders via Microemulsion Processing Routes
Wang, John, Fang, Jiye, Ng, Ser-Choon, Gan, Leong-Ming, Chew, Chwee-Har, Wang, Xianbin, Shen, Zexiang
Published in Journal of the American Ceramic Society (01.04.1999)
Published in Journal of the American Ceramic Society (01.04.1999)
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Journal Article
Femtosecond Z-scan investigation of nonlinear refraction in surface modified PbS nanoparticles
Li, H.P., Liu, B., Kam, C.H., Lam, Y.L., Que, W.X., Gan, L.M., Chew, C.H., Xu, G.Q.
Published in Optical materials (01.08.2000)
Published in Optical materials (01.08.2000)
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Journal Article
THIN SEMICONDUCTOR PACKAGE AND RELATED METHODS
LIEW, How Kiat, KRISHNAN, Shutesh, CHEW, CH, WANG, Sw Wei, TAN, Fui Fui
Year of Publication 12.11.2020
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Year of Publication 12.11.2020
Patent
Thin semiconductor package and related methods
Tan, Fui Fui, Liew, How Kiat, Chew, Ch, Wang, Sw Wei, Krishnan, Shutesh
Year of Publication 01.09.2020
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Year of Publication 01.09.2020
Patent
Acoustic diagnosis of aortic stenosis
Sun, Zhanyu, Poh, Kian-Keong, Ling, Lieng-Hsi, Hong, G S, Chew, Chye-Heng
Published in The Journal of heart valve disease (01.03.2005)
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Published in The Journal of heart valve disease (01.03.2005)
Journal Article