Effect of Cu content on properties of Cu/Zn+15%SAC0307+xCu/Al joint by ultrasonic excitation at low temperature
Xu, Qianzhu, Gan, Guisheng, Jiang, Zhaoqi, Chen, Shiqi, Huang, Tian, Liu, Cong, Ma, Peng, Cheng, Dayong, Wu, Yiping
Published in Journal of advanced joining processes (01.11.2021)
Published in Journal of advanced joining processes (01.11.2021)
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Journal Article
First-principles calculations of the elastic properties of ZrC and ZrN
Cheng, Dayong, Wang, Shaoqing, Ye, Hengqiang
Published in Journal of alloys and compounds (08.09.2004)
Published in Journal of alloys and compounds (08.09.2004)
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Journal Article
A laboratory study of the failure analysis of copper tube used in the air conditioning heat exchanger
Wang, Zhongqi, Li, Haihong, Cheng, Dayong, Qin, Shiteng, Li, Deshan, Zhang, Xintao
Published in Materials and corrosion (01.07.2024)
Published in Materials and corrosion (01.07.2024)
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Journal Article
Influence of aging temperature on the properties of Cu/(SAC0307 powder +Zn-particles)/Al joints ultrasonic-assisted soldered at low temperature
Gan, Guisheng, Chen, Shiqi, Jiang, Liujie, Xu, Qianzhu, Huang, Tian, Cheng, Dayong, Liu, Xin
Published in Soldering & surface mount technology (21.04.2023)
Published in Soldering & surface mount technology (21.04.2023)
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Journal Article
Properties of Cu/SAC0307 mixed solder balls/Cu joints with different Zn-particles content at low-temperature under ultrasonic assisted
Gan, Guisheng, Chen, Shiqi, Jiang, Liujie, Liu, Cong, Huang, Tian, Ma, Peng, Cheng, Dayong, Liu, Xin
Published in Soldering & surface mount technology (21.04.2023)
Published in Soldering & surface mount technology (21.04.2023)
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Journal Article
Thermal aging effects on the properties of the Cu/(SAC0307 powder + Zn-particles)/Cu joint ultrasonic-assisted soldered at low-temperature
Gan, Guisheng, Chen, Shiqi, Jiang, Liujie, Jiang, Zhaoqi, Liu, Cong, Ma, Peng, Cheng, Dayong, Liu, Xin
Published in Soldering & surface mount technology (28.02.2023)
Published in Soldering & surface mount technology (28.02.2023)
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Journal Article
Properties of Cu/Zn+15%SAC0307+15%Cu/Al joints by different ultrasonic-assisted degrees
Huang, Tian, Gan, Guisheng, Liu, Cong, Ma, Peng, Ma, Yongchong, Tang, Zheng, Cheng, Dayong, Liu, Xin, Tian, Kun
Published in Microelectronics international (17.03.2023)
Published in Microelectronics international (17.03.2023)
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Journal Article
Influence of bonding temperature on the properties of Cu/(SAC mixed powder)/Al joints under ultrasonic-assisted
Gan, Guisheng, Chen, Shi-qi, Jiang, Liujie, Liu, Cong, Ma, Peng, Huang, Tian, Cheng, Dayong, Liu, Xin
Published in Soldering & surface mount technology (30.06.2023)
Published in Soldering & surface mount technology (30.06.2023)
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Journal Article
Magic structures and quantum conductance of silver nanowires
Cheng, Dayong, Kim, Woo Youn, Min, Seung Kyu, Nautiyal, Tashi, Kim, Kwang S
Published in Physical review letters (10.03.2006)
Published in Physical review letters (10.03.2006)
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Journal Article
Effect of Loading Distance on the Properties of Cu/Zn+15%SAC0307+15%Cu/Al Joints by Dual Ultrasonic-assisted
Huang, Tian, Gan, Guisheng, Ma, Peng, Liu, Cong, Ma, Yongchong, Yang, Zhenyu, Cheng, Dayong, Li, Chuntian, Zhao, Jing
Published in 2022 23rd International Conference on Electronic Packaging Technology (ICEPT) (10.08.2022)
Published in 2022 23rd International Conference on Electronic Packaging Technology (ICEPT) (10.08.2022)
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