Development of Cu/Ni/SnAg Microbump Bonding Processes for Thin Chip-on-Chip Packages Via Wafer-Level Underfill Film
LEE, Chang-Chun, YANG, Tsung-Fu, KAO, Kuo-Shu, CHENG, Ren-Chin, ZHAN, Chau-Jie, CHEN, Tai-Hong
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.09.2012)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.09.2012)
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Journal Article
Evaluation of Cu/Ni/SnAg microbump bonding processes for thin-chip-on-chip package using a wafer-level underfill film
Chang-Chun Lee, Tsung-Fu Yang, Kuo-Shu Kao, Ren-Chin Cheng, Chau-Jie Zhan, Tai-Hong Chen
Published in 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (01.05.2012)
Published in 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (01.05.2012)
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Conference Proceeding
Reliability estimation and failure mode prediction for 3D chip stacking package with the application of wafer-level underfill
Lee, Chang-Chun, Yang, Tsung-Fu, Wu, Chih-Sheng, Kao, Kuo-Shu, Cheng, Ren-Chin, Chen, Tai-Hong
Published in Microelectronic engineering (01.07.2013)
Published in Microelectronic engineering (01.07.2013)
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Journal Article
Conference Proceeding
Assembly analysis of Cu/Ni/SnAg microbump for stacking thin chips in a fine pitch package using a wafer-level underfill
Chang-Chun Lee, Tsung-Fu Yang, Kuo-Shu Kao, Ren-Chin Cheng, Chau-Jie Zhan
Published in 2012 14th International Conference on Electronic Materials and Packaging (EMAP) (01.12.2012)
Published in 2012 14th International Conference on Electronic Materials and Packaging (EMAP) (01.12.2012)
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Conference Proceeding