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"CHEN TIANAN"
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"CHEN TIANAN"
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High-heat-conductivity epoxy resin electronic binding glue
by
LIN RONGXING
,
WANG JIANBIN
,
CHEN TIANAN
Year of Publication
20.07.2011
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Light-emitting diode (LED) packaging silica gel and preparation method thereof
by
CHEN WEI
,
ZHUANG HENGDONG
,
WANG JIANBIN
,
CHEN TIANAN
Year of Publication
06.11.2013
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163
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Low-cost radiating silica gel sheet and preparation method thereof
by
ZHAO RENLI
,
XIE HAIHUA
,
WANG HONGYU
,
WANG JIANBIN
,
CHEN TIANAN
Year of Publication
25.09.2013
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164
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High-reliability intelligent-card encapsulating glue and preparation method thereof
by
WANG HONGJUAN
,
WANG JIANBIN
,
CHEN TIANAN
Year of Publication
18.05.2011
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Double curing encapsulating adhesive and preparation method thereof
by
WANG HONGJUAN
,
XIE HAIHUA
,
WANG JIANBIN
,
CHEN TIANAN
Year of Publication
04.09.2013
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166
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Matte adhesive and preparation method thereof
by
LUO WANXING
,
XIE HAIHUA
,
WANG JIANBIN
,
CHEN TIANAN
Year of Publication
04.09.2013
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Conductive adhesive for LED (light emitting diode) packaging and preparation method of conductive adhesive
by
WU GUANGYONG
,
WANG JIANBIN
,
CHEN TIANAN
Year of Publication
04.09.2013
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168
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Liquid epoxy encapsulating material and preparation method thereof
by
ZHOU JIANZHONG
,
WANG JIANBIN
,
CHEN TIANAN
Year of Publication
27.04.2011
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Method for synthesizing weather-resistance polyurethane and acrylic ester prepolymer
by
CUI HENGLI
,
WANG JIANBIN
,
CHEN TIANAN
Year of Publication
13.04.2011
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170
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Light-cured resin with low water absorption and preparation method thereof
by
PAN GUANGJUN
,
WANG JIANBIN
,
CHEN TIANAN
Year of Publication
13.04.2011
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171
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Double-solidification system fast-flowing underfill and preparation method thereof
by
WANG HONGJUAN
,
WANG JIANBIN
,
CHEN TIANAN
Year of Publication
13.04.2011
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Adhesive and compounding method thereof
by
CHEN WEI
,
WU JUN
,
WANG JIANBIN
,
CHEN TIANAN
Year of Publication
31.07.2013
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SMT (surface mounted technology) surface mount adhesive and preparation method thereof
by
ZHOU JIANZHONG
,
WANG JIANBIN
,
CHEN TIANAN
Year of Publication
16.03.2011
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174
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Low-viscosity and high-heat conduction epoxy resin electronic potting adhesive
by
LIN RONGXING
,
WANG JIANBIN
,
CHEN TIANAN
Year of Publication
16.02.2011
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175
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Single-component photo-curable and thermal-curable adhesive and preparation method thereof
by
XIE HAIHUA
,
PAN GUANGJUN
,
WANG JIANBIN
,
CHEN TIANAN
Year of Publication
19.06.2013
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Silica gel fin and preparation method thereof
by
XIE HAIHUA
,
WANG HONGYU
,
WANG JIANBIN
,
CHEN TIANAN
Year of Publication
19.06.2013
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Low-viscosity dimer acid type polyamine hot melt adhesive and preparation method thereof
by
BAI ZHANZHENG
,
WANG JIANBIN
,
CHEN TIANAN
Year of Publication
02.02.2011
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Method for synthesizing low-hardness polyurethane acrylate
by
CUI HENGLI
,
WANG JIANBIN
,
CHEN TIANAN
Year of Publication
05.01.2011
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Polyamide hot cement with high softening point and low-temperature resistance, and preparing method thereof
by
ZHOU HONGFU
,
WANG JIANBIN
,
CHEN TIANAN
Year of Publication
29.12.2010
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Organic silicon heat radiation material and preparation method thereof
by
XIE HAIHUA
,
WANG HONGYU
,
WANG JIANBIN
,
CHEN TIANAN
Year of Publication
24.04.2013
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