Mitigating single-event multiple transients in a combinational circuit based on standard cells
Zhao, Wen, Chen, Wei, He, Chaohui, Chen, Rongmei, Cong, Peitian, Zhang, Fengqi, Lu, Chao, Shen, Chen, Zheng, Lisang, Guo, Xiaoqiang, Ding, Lili
Published in Microelectronics and reliability (01.06.2020)
Published in Microelectronics and reliability (01.06.2020)
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Journal Article
Variability Study of MWCNT Local Interconnects Considering Defects and Contact Resistances-Part I: Pristine MWCNT
Chen, Rongmei, Liang, Jie, Lee, Jaehyun, Georgiev, Vihar P., Ramos, Raphael, Okuno, Hanako, Kalita, Dipankar, Cheng, Yuanqing, Zhang, Liuyang, Pandey, Reetu R., Amoroso, Salvatore, Millar, Campbell, Asenov, Asen, Dijon, Jean, Todri-Sanial, Aida
Published in IEEE transactions on electron devices (01.11.2018)
Published in IEEE transactions on electron devices (01.11.2018)
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Journal Article
Single-event multiple transients in guard-ring hardened inverter chains of different layout designs
Zhao, Wen, He, Chaohui, Chen, Wei, Chen, Rongmei, Cong, Peitian, Zhang, Fengqi, Wang, Zujun, Shen, Chen, Zheng, Lisang, Guo, Xiaoqiang, Ding, Lili
Published in Microelectronics and reliability (01.08.2018)
Published in Microelectronics and reliability (01.08.2018)
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Journal Article
Prediction of single event upset critical charge and sensitive volume depth by energy deposition analysis of low energy protons
Zhao, Wen, Chen, Wei, He, Chaohui, Chen, Rongmei, Wang, Liang, Wang, Zujun, Cong, Peitian, Guo, Xiaoqiang, Shen, Chen
Published in Radiation effects and defects in solids (01.11.2020)
Published in Radiation effects and defects in solids (01.11.2020)
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Journal Article
High electromagnetic pulse environment test technology in pulse power research
Tan Zhaojie, Chen Rongmei, Meng Cui, Li Xin
Published in 2013 Asia-Pacific Symposium on Electromagnetic Compatibility (APEMC) (01.05.2013)
Published in 2013 Asia-Pacific Symposium on Electromagnetic Compatibility (APEMC) (01.05.2013)
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Conference Proceeding
Variability Study of MWCNT Local Interconnects Considering Defects and Contact Resistances-Part II: Impact of Charge Transfer Doping
Chen, Rongmei, Liang, Jie, Lee, Jaehyun, Georgiev, Vihar P., Ramos, Raphael, Okuno, Hanako, Kalita, Dipankar, Cheng, Yuanqing, Zhang, Liuyang, Pandey, Reetu R., Amoroso, Salvatore, Millar, Campbell, Asenov, Asen, Dijon, Jean, Todri-Sanial, Aida
Published in IEEE transactions on electron devices (01.11.2018)
Published in IEEE transactions on electron devices (01.11.2018)
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Journal Article
Improved on-chip self-triggered single-event transient measurement circuit design and applications
Chen, Rongmei, Chen, Wei, Guo, Xiaoqiang, Shen, Chen, Zhang, Fengqi, Zheng, Lisang, Zhao, Wen, Ding, Lili, Luo, Yinhong, Guo, Hongxia, Wang, Yuanming, Liu, Yinong
Published in Microelectronics and reliability (01.04.2017)
Published in Microelectronics and reliability (01.04.2017)
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Journal Article
The Promise of 2-D Materials for Scaled Digital and Analog Applications
Verreck, Devin, Wambacq, Piet, Van De Put, Maarten, Ahmed, Zubair, Smets, Quentin, Afzalian, Aryan, Duflou, Rutger, Wu, Xiangyu, Mirabelli, Gioele, Chen, Rongmei, Asselberghs, Inge, Kar, Gouri Sankar
Published in 2023 IEEE International Solid- State Circuits Conference (ISSCC) (19.02.2023)
Published in 2023 IEEE International Solid- State Circuits Conference (ISSCC) (19.02.2023)
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Conference Proceeding
Impact of Temporal Masking of Flip-Flop Upsets on Soft Error Rates of Sequential Circuits
Chen, R. M., Mahatme, N. N., Diggins, Z. J., Wang, L., Zhang, E. X., Chen, Y. P., Liu, Y. N., Narasimham, B., Witulski, A. F., Bhuva, B. L., Fleetwood, D. M.
Published in IEEE transactions on nuclear science (01.08.2017)
Published in IEEE transactions on nuclear science (01.08.2017)
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Journal Article
Thermal Mitigation Strategy for Backside Power Delivery Network
Xie, Feifan, Chen, Rongmei, Wei, Tiwei
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
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Conference Proceeding
Progress on carbon nanotube BEOL interconnects
Uhlig, B., Liang, J., Lee, J., Ramos, R., Dhavamani, A., Nagy, N., Dijon, J., Okuno, H., Kalita, D., Georgiev, V., Asenov, A., Amoroso, S., Wang, L., Millar, C., Konemann, F., Gotsmann, B., Goncalves, G., Chen, B., Pandey, R. R., Chen, R., Todri-Sanial, A.
Published in 2018 Design, Automation & Test in Europe Conference & Exhibition (DATE) (01.03.2018)
Published in 2018 Design, Automation & Test in Europe Conference & Exhibition (DATE) (01.03.2018)
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Conference Proceeding
Design Enablement of 3-Dies Stacked 3D-ICs Using Fine-Pitch Hybrid-Bonding and TSVs
Naeim, Mohamed, Yang, Hanqi, Chen, Pinhong, Bao, Rong, Dekeyser, Antoine, Sisto, Giuliano, Brunion, Moritz, Chen, Rongmei, Van der Plas, Geert, Beyne, Eric, Milojevic, Dragomir
Published in 2023 IEEE International 3D Systems Integration Conference (3DIC) (10.05.2023)
Published in 2023 IEEE International 3D Systems Integration Conference (3DIC) (10.05.2023)
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Conference Proceeding
Design Enablement of Fine Pitch Face-to-Face 3D System Integration using Die-by-Die Place & Route
Sisto, Giuliano, Debacker, Peter, Chen, Rongmei, Van Der Plas, Geert, Chou, Richard, Beyne, Eric, Milojevic, Dragomir
Published in 2019 International 3D Systems Integration Conference (3DIC) (01.10.2019)
Published in 2019 International 3D Systems Integration Conference (3DIC) (01.10.2019)
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Conference Proceeding
Design And Sign-off Methodologies For Wafer-To-Wafer Bonded 3D-ICs At Advanced Nodes (invited)
Sisto, Giuliano, Chen, Rongmei, Chou, Richard, Van der Plas, Geert, Beyne, Eric, Metcalfe, Rod, Milojevic, Dragomir
Published in 2021 ACM/IEEE International Workshop on System Level Interconnect Prediction (SLIP) (01.11.2021)
Published in 2021 ACM/IEEE International Workshop on System Level Interconnect Prediction (SLIP) (01.11.2021)
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Conference Proceeding
A METHOD FOR FORMING A SEMICONDUCTOR DEVICE WITH A BURIED POWER RAIL
VELOSO, Anabela, MATAGNE, Philippe, CHEN, Rongmei, ENEMAN, Geert, DE KEERSGIETER, An
Year of Publication 05.06.2024
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Year of Publication 05.06.2024
Patent
Method for Forming a Semiconductor Device
Chen, Rongmei, Veloso, Anabela, Eneman, Geert, De Keersgieter, An, Matagne, Philippe
Year of Publication 30.05.2024
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Year of Publication 30.05.2024
Patent
Circuit-level Prediction of Charge Sharing Transients and Upsets for Various Well Contacts
Ding, Lili, Chen, Wei, Wang, Tan, Luo, Yinhong, Zhang, Fengqi, Chen, Rongmei, Pan, Xiaoyu, Sun, Huabo, Chen, Lei
Published in 2018 18th European Conference on Radiation and Its Effects on Components and Systems (RADECS) (01.09.2018)
Published in 2018 18th European Conference on Radiation and Its Effects on Components and Systems (RADECS) (01.09.2018)
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Conference Proceeding