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Year of Publication 01.07.2017
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Method to improve bump reliability for flip chip device
SU CHAO-YUAN, LIN CHIA-FU, CHEN YEN-MING, CHING KAI-MING, LEE HSIN-HUI, CHEN LIIH, HSU SHUN-LIANG
Year of Publication 30.07.2013
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Year of Publication 30.07.2013
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Fluxless bumping process
SU CHAO-YUAN, LIN CHIA-FU, CHEN YEN-MING, JIAN YUE-YING, CHING KAI-MING, KUO WENANG, LEE HSIN-HUI, CHEN LIIH
Year of Publication 15.03.2011
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Year of Publication 15.03.2011
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Fluxless bumping process
SU CHAO-YUAN, LIN CHIA-FU, CHEN YEN-MING, JIAN YUE-YING, CHING KAI-MING, KUO WENANG, LEE HSIN-HUI, CHEN LIIH
Year of Publication 08.02.2007
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Year of Publication 08.02.2007
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Fluxless bumping process
SU CHAO-YUAN, LIN CHIA-FU, CHEN YEN-MING, JIAN YUE-YING, CHING KAI-MING, KUO WENANG, LEE HSIN-HUI, CHEN LIIH
Year of Publication 14.11.2006
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Year of Publication 14.11.2006
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Application of impressed-current cathodic protection to prevent metal corrosion and oxidation
SU CHAO-YUAN, CHEN YEN-MING, LIN TA-MIN, CHING KAI-MING, LIN CHIA FU, TSENG WEN-HSIANG, LEE HSIN-HUI, CHEN LIIH
Year of Publication 02.10.2007
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Year of Publication 02.10.2007
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Method of forming a solder ball using a thermally stable resinous protective layer
SU CHAO-YUAN, LIN CHIA-FU, CHEN YEN-MING, CHING KAI-MING, LEE HSIN-HUI, CHEN LIIH
Year of Publication 13.12.2005
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Year of Publication 13.12.2005
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Stencil design for solder paste printing
SU CHAO-YUAN, LIN CHIA-FU, CHEN YEN-MING, CHING KAI-MING, LEE HSIN-HUI, CHEN LIIH
Year of Publication 12.10.2004
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Year of Publication 12.10.2004
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Novel method to improve bump reliability for flip chip device
SU CHAO-YUAN, LIN CHIA-FU, CHEN YEN-MING, CHING KAI-MING, LEE HSIN-HUI, CHEN LIIH, HSU SHUN-LIANG
Year of Publication 16.09.2004
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Year of Publication 16.09.2004
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Method for improving bump reliability for flip chip devices
SU CHAO-YUAN, LIN CHIA-FU, CHEN YEN-MING, CHING KAI-MING, LEE HSIN-HUI, CHEN LIIH, HSU SHUN-LIANG
Year of Publication 29.06.2004
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Year of Publication 29.06.2004
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Method of making a wafer level chip scale package
SU CHAO-YUAN, LIN CHIA-FU, CHEN YEN-MING, CHING KAI-MING, LEE HSIN-HUI, CHEN LIIH
Year of Publication 01.06.2004
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Year of Publication 01.06.2004
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Fluxless bumping process using ions
SU CHAO-YUAN, LIN CHIA-FU, CHEN YENG-MING, TIEN HAOIH, CHING KAI-MING, LEE HSIN-HUI, CHEN LIIH
Year of Publication 01.01.2004
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Year of Publication 01.01.2004
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Fluxless bumping process
SU CHAO-YUAN, LIN CHIA-FU, CHEN YEN-MING, JIAN YUE-YING, CHING KAI-MING, KUO WENANG, LEE HSIN-HUI, CHEN LIIH
Year of Publication 18.12.2003
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Year of Publication 18.12.2003
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DFR laminating and film removing system
SU CHAO-YUAN, LIN CHIA-FU, HSU CHIA-TSUN, CHEN YEN-MING, LEE KUOING, CHING KAI-MING, LEE HSIN-HUI, CHEN LIIH
Year of Publication 11.12.2003
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Year of Publication 11.12.2003
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