Assessment of microstructure and shear strength for low melting point tin-free alloys on Cu
Chen, Chih-Hao, Chakroborty, Subhendu, Lee, Boon-Ho, Chen, Hsiang-Chuan, Wang, Chang-Meng, Wu, Albert T.
Published in Materials science & engineering. A, Structural materials : properties, microstructure and processing (21.12.2017)
Published in Materials science & engineering. A, Structural materials : properties, microstructure and processing (21.12.2017)
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Journal Article
A novel temporary adhesive for solder ball attachment in fluxless reflow system
Ruei-Ying Sheng, Chen-Yi Chen, Hsiang-Chuan Chen, Chang-Meng Wang
Published in 2017 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2017)
Published in 2017 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2017)
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Conference Proceeding
Study on a formulated no clean flux for fine-pitch flip chip package of copper pillar/microbump interconnect
Hsiang-Chuan Chen, Ya-Ching Chuang, Chia-Hao Chang, Tseng, Watson
Published in 2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2016)
Published in 2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2016)
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Conference Proceeding
Development of New Low Melting Solder Alloys
Chih-Hao Chen, Boon-Ho Lee, Hsiang-Chuan Chen, Chang-Meng Wang, Wu, Albert T.
Published in 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) (01.05.2016)
Published in 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) (01.05.2016)
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Conference Proceeding
Liquid composition
Zhong, Yuan-Heng, Chen, Hsiang-Chuan, Chen, Chih-Hao, Wang, Chang-Meng, Wu, Albert T, Sheng, Ruei-Ying, Chen, Chen-Yi
Year of Publication 04.02.2020
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Year of Publication 04.02.2020
Patent
Multilayered infrared light reflective structure
Chung, Pao-Tang, Chen, Hsiang-Chuan, Chu, Jen-You, Chen, Yi-Ping, Lin, Chin-Ching, Chiang, Mei-Ching
Year of Publication 06.09.2017
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Year of Publication 06.09.2017
Patent
A New Dispensing Solder Paste for Laser Soldering Technology
Chen, Hsiang-Chuan, Chuang, Ya-Ching, Shiu, Jen-Yio, Wang, Chang-Meng, Tseng, Watson
Published in SMT (Online) (01.07.2016)
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Published in SMT (Online) (01.07.2016)
Trade Publication Article
Multilayered infrared light reflective structure
Chung, Pao-Tang, Chen, Hsiang-Chuan, Chu, Jen-You, Chen, Yi-Ping, Lin, Chin-Ching, Chiang, Mei-Ching
Year of Publication 06.06.2012
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Year of Publication 06.06.2012
Patent
Multilayered infrared light reflective structure
CHEN, HSIANG CHUAN, CHUNG, PAO TANG, CHIANG, MEI CHING, CHU, JEN YOU, CHEN, YI PING, LIN, CHIN CHING
Year of Publication 01.08.2014
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Year of Publication 01.08.2014
Patent
Solar cell device
CHEN, HSIANG CHUAN, CHUANG, PEI CHEN, CHIANG, MEI CHING, CHU, JEN YOU, CHEN, YI PING, LIN, CHIN CHING
Year of Publication 01.06.2014
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Year of Publication 01.06.2014
Patent
Solar cell device and method for fabricatign the same
CHEN, HSIANG CHUAN, CHIU, KUO CHUANG, CHIANG, MEI CHING, HO, CHAO JEN, LIN, CHIN CHING
Year of Publication 01.01.2013
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Year of Publication 01.01.2013
Patent