Flexible Textile-Based Pressure Sensing System Applied in the Operating Room for Pressure Injury Monitoring of Cardiac Operation Patients
Shih, De-Fen, Wang, Jyh-Liang, Chao, Sou-Chih, Chen, Yin-Fa, Liu, Kuo-Sheng, Chiang, Yi-Shan, Wang, Chi, Chang, Min-Yu, Yeh, Shu-Ling, Chu, Pao-Hsien, Lai, Chao-Sung, Shye, Der-Chi, Ho, Lun-Hui, Yang, Chia-Ming
Published in Sensors (Basel, Switzerland) (17.08.2020)
Published in Sensors (Basel, Switzerland) (17.08.2020)
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Journal Article
Effect of La addition on adhesive strength and fracture behavior of Sn–3.5Ag solder joints
Lee, Hwa-Teng, Chen, Yin-Fa, Schwedt, Alexander, Mayer, Joachim
Published in Materials science & engineering. A, Structural materials : properties, microstructure and processing (25.04.2011)
Published in Materials science & engineering. A, Structural materials : properties, microstructure and processing (25.04.2011)
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Journal Article
The Shear Strength and Fracture Behavior of Sn-Ag-xSb Solder Joints with Au/Ni-P/Cu UBM
Lee, Hwa-Teng, Hu, Shuen-Yuan, Hong, Ting-Fu, Chen, Yin-Fa
Published in Journal of electronic materials (01.06.2008)
Published in Journal of electronic materials (01.06.2008)
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Journal Article
Microstructural Evolution of Sn-Ag-Sb Solder with Indium Additions
Lee, Hwa-Teng, Lee, Choo-Yeow, Lee, Fok-Foo, Chen, Yin-Fa, Lee, Yang-Hsien
Published in Journal of electronic materials (01.10.2009)
Published in Journal of electronic materials (01.10.2009)
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Journal Article
The corrosion performance of Cu alloy wire bond on Al pad in molding compounds of various chlorine contents under biased-HAST
Ying-Ta Chiu, Tzu-Hsing Chiang, Yin-Fa Chen, Ping-Feng Yang, Huang, Louie, Kwang-Lung Lin
Published in 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) (01.05.2014)
Published in 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) (01.05.2014)
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Conference Proceeding
Effect of cooling rate on Ag3Sn formation in Sn-Ag based lead-free solder
Hwa-Teng Lee, Yin-Fa Chen, Ting-Fu Hong, Ku-Ta Shih
Published in 2009 11th Electronics Packaging Technology Conference (01.12.2009)
Published in 2009 11th Electronics Packaging Technology Conference (01.12.2009)
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Conference Proceeding
Evolution of Ag3Sn compounds in solidification of eutectic Sn-3.5Ag solder
Hwa-Teng Lee, Yin-Fa Chen, Ting-Fu Hong, Ku-Ta Shih
Published in 2009 International Conference on Electronic Packaging Technology & High Density Packaging (01.08.2009)
Published in 2009 International Conference on Electronic Packaging Technology & High Density Packaging (01.08.2009)
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Conference Proceeding
Influence of lanthanum addition on microstructure and properties of Sn-3.5Ag solder system
Hwa-Teng Lee, Yin-Fa Chen, Ting-Fu Hong, Yu-Jing Huang
Published in 2008 International Conference on Electronic Materials and Packaging (01.10.2008)
Published in 2008 International Conference on Electronic Materials and Packaging (01.10.2008)
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Conference Proceeding
Microstructural evolution of Sn-3.5Ag solder with lanthanum addition
Hwa-Teng Lee, Yin-Fa Chen, Ting-Fu Hong, Ku-Ta Shih, Che-wei Hsu
Published in 2009 International Conference on Electronic Packaging Technology & High Density Packaging (01.08.2009)
Published in 2009 International Conference on Electronic Packaging Technology & High Density Packaging (01.08.2009)
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Conference Proceeding
SEMICONDUCTOR PACKAGE STRUCTURE
CHEN, Chi-Yuan, TSAI, Yi-Lin, CHEN, Yin-Fa, HUNG, Kun-Ting, HSU, Wen-Sung
Year of Publication 11.01.2024
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Year of Publication 11.01.2024
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