Risk of dementia in patients with insomnia and long-term use of hypnotics: a population-based retrospective cohort study
Chen, Pin-Liang, Lee, Wei-Ju, Sun, Wei-Zen, Oyang, Yen-Jen, Fuh, Jong-Ling
Published in PloS one (07.11.2012)
Published in PloS one (07.11.2012)
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Journal Article
Risk of dementia after anaesthesia and surgery
Chen, Pin-Liang, Yang, Chih-Wen, Tseng, Yi-Kuan, Sun, Wei-Zen, Wang, Jane-Ling, Wang, Shuu-Jiun, Oyang, Yen-Jen, Fuh, Jong-Ling
Published in British journal of psychiatry (01.03.2014)
Published in British journal of psychiatry (01.03.2014)
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Journal Article
Using methods of time series data mining to recognize the influences of environmental factors on bullous pemphigoid
Lai, Jian-Liang, Chang, Yu-Ming, Chen, Pin-Liang, Chou, Lih-Ching, Lee, Ding-Dar, Yang, Meng-Han
Published in Journal of the Chinese Institute of Engineers (17.11.2018)
Published in Journal of the Chinese Institute of Engineers (17.11.2018)
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Journal Article
User behavior analysis and commodity recommendation for point-earning apps
Yu-Ching Chen, Chia-Ching Yang, Yan-Jian Liau, Chia-Hui Chang, Pin-Liang Chen, Ping-Che Yang, Tsun Ku
Published in 2016 Conference on Technologies and Applications of Artificial Intelligence (TAAI) (01.11.2016)
Published in 2016 Conference on Technologies and Applications of Artificial Intelligence (TAAI) (01.11.2016)
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Conference Proceeding
Direction controllable linearly polarized laser from a dye-doped cholesteric liquid crystal
Zhou, Ying, Huang, Yuhua, Lin, Tsung-Hsien, Chen, Liang-Pin, Hong, Qi, Wu, Shin-Tson
Published in Optics express (12.06.2006)
Published in Optics express (12.06.2006)
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Journal Article
Using spectroscopic reflectometer with FFT method to measure film thickness on glass wafer of fan-out package
Zhong, Sung-Hua, Chen, Liang-Pin
Published in 2021 16th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (21.12.2021)
Published in 2021 16th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (21.12.2021)
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Conference Proceeding
X-ray Inspection for FOMCM (Fan-Out Multi Chip Module) μ-bump Non-wet
Ke, Chung-Yu, Chen, Liang-Pin
Published in 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) (07.12.2021)
Published in 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) (07.12.2021)
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Conference Proceeding
2D X-Ray Void Detection for Next Generation Copper Pillar Bump
Ke, Chung-Yu, Chen, Liang-Pin
Published in 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) (07.12.2021)
Published in 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) (07.12.2021)
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Conference Proceeding
Thickness measurement of multi-layer thin film alloy by X-ray fluorescence spectrometer
Zhong, Sung-Hua, Chen, Liang-Pin
Published in 2021 22nd International Conference on Electronic Packaging Technology (ICEPT) (14.09.2021)
Published in 2021 22nd International Conference on Electronic Packaging Technology (ICEPT) (14.09.2021)
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Conference Proceeding
Enhanced photonic band edge laser emission in a cholesteric liquid crystal resonator
Zhou, Ying, Huang, Yuhua, Ge, Zhibing, Chen, Liang-Pin, Hong, Qi, Wu, Thomas X, Wu, Shin-Tson
Published in Physical review. E, Statistical, nonlinear, and soft matter physics (01.12.2006)
Published in Physical review. E, Statistical, nonlinear, and soft matter physics (01.12.2006)
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Journal Article
Structured Learning Applied to Consumer Goods Recommended
Chen, Yu-Ching, Yang, Chia-Ching, Chen, Yu-Han, Montella, Sebastien, Chang, Chia-Hui, Chen, Pin-Liang, Yang, Ping-Che, Ku, Tsun
Published in 2017 Conference on Technologies and Applications of Artificial Intelligence (TAAI) (01.12.2017)
Published in 2017 Conference on Technologies and Applications of Artificial Intelligence (TAAI) (01.12.2017)
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Conference Proceeding
Establish a Rule for the selection of ion residue testing machines for different ion pollution sources
Chang, Shih-Ping, Chen, Liang-Pin
Published in 2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (26.10.2022)
Published in 2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (26.10.2022)
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Conference Proceeding